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IS42S16100E PDF预览

IS42S16100E

更新时间: 2024-02-04 23:56:34
品牌 Logo 应用领域
美国芯成 - ISSI /
页数 文件大小 规格书
82页 1535K
描述
512K Words x 16 Bits x 2 Banks 16Mb SYNCHRONOUS DYNAMIC RAM

IS42S16100E 数据手册

 浏览型号IS42S16100E的Datasheet PDF文件第2页浏览型号IS42S16100E的Datasheet PDF文件第3页浏览型号IS42S16100E的Datasheet PDF文件第4页浏览型号IS42S16100E的Datasheet PDF文件第5页浏览型号IS42S16100E的Datasheet PDF文件第6页浏览型号IS42S16100E的Datasheet PDF文件第7页 
IS42S16100E  
IS45S16100E  
512K Words x 16 Bits x 2 Banks  
16Mb SYNCHRONOUS DYNAMIC RAM  
SEPTEMBER 2009  
FEATURES  
•ꢀ Clock frequency: 200, 166, 143 MHz  
DESCRIPTION  
ISSI’sꢀ16MbꢀSynchronousꢀDRAMꢀIS42/4516100Eꢀisꢀ  
organizedꢀasꢀaꢀ524,288-wordꢀxꢀ16-bitꢀxꢀ2-bankꢀforꢀ  
improvedꢀperformance.ꢀTheꢀsynchronousꢀDRAMsꢀ  
achieve high-speed data transfer using pipeline  
architecture. All inputs and outputs signals refer to the  
rising edge of the clock input.  
•ꢀ Fullyꢀsynchronous;ꢀallꢀsignalsꢀreferencedꢀtoꢀaꢀ  
positive clock edge  
•ꢀ Twoꢀbanksꢀcanꢀbeꢀoperatedꢀsimultaneouslyꢀandꢀ  
independently  
•ꢀ DualꢀinternalꢀbankꢀcontrolledꢀbyꢀA11ꢀ(bankꢀselect)  
•ꢀ Singleꢀ3.3Vꢀpowerꢀsupply  
•ꢀ LVTTLꢀinterface  
•ꢀ Programmableꢀburstꢀlengthꢀ  
–ꢀ(1,ꢀ2,ꢀ4,ꢀ8,ꢀfullꢀpage)  
PIN CONFIGURATIONS  
50-Pin TSOP (Type II)  
VDD  
DQ0  
DQ1  
GNDQ  
DQ2  
DQ3  
VDDQ  
DQ4  
DQ5  
GNDQ  
DQ6  
DQ7ꢀ  
VDDQ  
LDQM  
WE  
CAS  
RAS  
CS  
A11  
A10  
A0  
A1  
A2  
A3  
1
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
GND  
DQ15  
DQ14  
GNDQ  
DQ13  
DQ12  
VDDQ  
DQ11  
DQ10  
GNDQ  
DQ9  
DQ8  
VDDQ  
NC  
UDQM  
CLK  
CKE  
NC  
A9  
A8  
•ꢀ Programmableꢀburstꢀsequence:ꢀ  
2
Sequential/Interleave  
3
4
•ꢀ 2048ꢀrefreshꢀcyclesꢀeveryꢀ32msꢀ(Com,ꢀInd,ꢀA1ꢀ  
grade)ꢀorꢀ16msꢀ(A2ꢀgrade)  
•ꢀ Randomꢀcolumnꢀaddressꢀeveryꢀclockꢀcycle  
5
6
7
8
•ꢀ ProgrammableꢀCASꢀlatencyꢀ(2,ꢀ3ꢀclocks)  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
•ꢀ Burstꢀread/writeꢀandꢀburstꢀread/singleꢀwriteꢀ  
operations capability  
•ꢀ Burstꢀterminationꢀbyꢀburstꢀstopꢀandꢀ  
precharge command  
•ꢀ ByteꢀcontrolledꢀbyꢀLDQMꢀandꢀUDQM  
•ꢀ Packages:ꢀ400-milꢀ50-pinꢀTSOP-IIꢀandꢀ60-ballꢀ  
TF-BGA  
•ꢀ TemperatureꢀGrades:  
Commercialꢀ(0oC to +70oC)  
Industrialꢀ(-40oCꢀtoꢀ+85oC)  
ꢀꢀꢀꢀAutomotiveꢀA1ꢀ(-40oCꢀtoꢀ+85oC)  
ꢀꢀꢀꢀAutomotiveꢀA2ꢀ(-40oCꢀtoꢀ+105oC)  
A7  
A6  
A5  
A4  
VDD  
GND  
PIN DESCRIPTIONS  
CAS  
Column Address Strobe Command  
A0-A10 ꢀ  
RowꢀAddressꢀInput  
BankꢀSelectꢀAddress  
Column Address Input  
DataꢀDQ  
WEꢀ  
WriteꢀEnable  
A11ꢀꢀ  
LDQMꢀ LowerꢀBye,ꢀInput/OutputꢀMask  
UDQMꢀ UpperꢀBye,ꢀInput/OutputꢀMask  
A0-A7  
DQ0ꢀtoꢀDQ15ꢀ  
VDDꢀ  
GNDꢀ  
Power  
CLKꢀ  
CKEꢀ  
CS  
SystemꢀClockꢀInput  
ClockꢀEnable  
Ground  
VDDQꢀ PowerꢀSupplyꢀforꢀDQꢀPin  
GNDQꢀ GroundꢀforꢀDQꢀPin  
Chip Select  
RASꢀ  
RowꢀAddress Strobe Command  
NCꢀ  
NoꢀConnection  
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without  
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the lat-  
est version of this device specification before relying on any published information and before placing orders for products.  
Integrated Silicon Solution, Inc. — www.issi.com  
1
Rev. D  
08/24/09  

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