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IS42S16100-6TI PDF预览

IS42S16100-6TI

更新时间: 2024-11-05 20:05:27
品牌 Logo 应用领域
矽成 - ICSI 时钟动态存储器光电二极管内存集成电路
页数 文件大小 规格书
78页 1061K
描述
Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50,

IS42S16100-6TI 技术参数

是否Rohs认证: 不符合生命周期:Transferred
包装说明:TSOP, TSOP50,.46,32Reach Compliance Code:unknown
风险等级:5.83最长访问时间:5.5 ns
最大时钟频率 (fCLK):166 MHzI/O 类型:COMMON
交错的突发长度:1,2,4,8JESD-30 代码:R-PDSO-G50
JESD-609代码:e0内存密度:16777216 bit
内存集成电路类型:SYNCHRONOUS DRAM内存宽度:16
端子数量:50字数:1048576 words
字数代码:1000000最高工作温度:85 °C
最低工作温度:-40 °C组织:1MX16
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSOP封装等效代码:TSOP50,.46,32
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
电源:3.3 V认证状态:Not Qualified
刷新周期:4096连续突发长度:1,2,4,8,FP
最大待机电流:0.002 A子类别:DRAMs
最大压摆率:0.145 mA标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.8 mm
端子位置:DUALBase Number Matches:1

IS42S16100-6TI 数据手册

 浏览型号IS42S16100-6TI的Datasheet PDF文件第2页浏览型号IS42S16100-6TI的Datasheet PDF文件第3页浏览型号IS42S16100-6TI的Datasheet PDF文件第4页浏览型号IS42S16100-6TI的Datasheet PDF文件第5页浏览型号IS42S16100-6TI的Datasheet PDF文件第6页浏览型号IS42S16100-6TI的Datasheet PDF文件第7页 
IS42S16100  
512K Words x 16 Bits x 2 Banks (16-MBIT)  
SYNCHRONOUS DYNAMIC RAM  
FEATURES  
DESCRIPTION  
ICSI's 16Mb Synchronous DRAM IS42S16100 is organized  
as a 524,288-word x 16-bit x 2-bank for improved  
performance. The synchronous DRAMs achieve high-speed  
data transfer using pipeline architecture. All inputs and  
outputs signals refer to the rising edge of the clock input.  
• Clock frequency: 166, 143, 125, 100 MHz  
• Fully synchronous; all signals referenced to a  
positive clock edge  
• Two banks can be operated simultaneously and  
independently  
• Dual internal bank controlled by A11 (bank select)  
• Single 3.3V power supply  
• LVTTL interface  
PIN CONFIGURATIONS  
50-Pin TSOP-2  
VCC  
I/O0  
I/O1  
GNDQ  
I/O2  
I/O3  
VCCQ  
I/O4  
I/O5  
GNDQ  
I/O6  
I/O7  
VCCQ  
LDQM  
WE  
1
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
GND  
I/O15  
I/O14  
GNDQ  
I/O13  
I/O12  
VCCQ  
I/O11  
I/O10  
GNDQ  
I/O9  
I/O8  
VCCQ  
NC  
• Programmable burst length  
– (1, 2, 4, 8, full page)  
• Programmable burst sequence:  
Sequential/Interleave  
2
3
4
5
6
• Auto refresh, self refresh  
7
8
• 4096 refresh cycles every 128 ms  
• Random column address every clock cycle  
• Programmable CAS latency (2, 3 clocks)  
• Burst read/write and burst read/single write  
operations capability  
• Burst termination by burst stop and precharge  
command  
• Byte controlled by LDQM and UDQM  
• Package 400mil 50-pin TSOP-2  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
UDQM  
CLK  
CKE  
NC  
CAS  
RAS  
CS  
A11  
A9  
A10  
A8  
A0  
A7  
A1  
A6  
A2  
A5  
A3  
A4  
VCC  
GND  
PIN DESCRIPTIONS  
A0-A11  
A0-A10  
A11  
Address Input  
CAS  
Column Address Strobe Command  
Write Enable  
Row Address Input  
Bank Select Address  
Column Address Input  
Data I/O  
WE  
LDQM  
UDQM  
Vcc  
Lower Bye, Input/Output Mask  
Upper Bye, Input/Output Mask  
Power  
A0-A7  
I/O0 to I/O15  
CLK  
System Clock Input  
Clock Enable  
GND  
VccQ  
GNDQ  
NC  
Ground  
CKE  
Power Supply for I/O Pin  
Ground for I/O Pin  
No Connection  
CS  
Chip Select  
RAS  
Row Address Strobe Command  
ICSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors  
which may appear in this publication. © Copyright 2000, Integrated Circuit Solution Inc.  
Integrated Circuit Solution Inc.  
1
DR006-0B  

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