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IS42R32200C1-75TI PDF预览

IS42R32200C1-75TI

更新时间: 2024-09-24 21:16:27
品牌 Logo 应用领域
美国芯成 - ISSI 时钟动态存储器光电二极管内存集成电路
页数 文件大小 规格书
56页 579K
描述
Synchronous DRAM, 2MX32, 6.5ns, CMOS, PDSO86, 0.400 INCH, PLASTIC, TSOP2-86

IS42R32200C1-75TI 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:TSOP2
包装说明:TSOP2, TSSOP86,.46,20针数:86
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.02风险等级:5.92
访问模式:FOUR BANK PAGE BURST最长访问时间:6.5 ns
其他特性:AUTO/SELF REFRESH最大时钟频率 (fCLK):133 MHz
I/O 类型:COMMON交错的突发长度:1,2,4,8
JESD-30 代码:R-PDSO-G86JESD-609代码:e0
长度:22.22 mm内存密度:67108864 bit
内存集成电路类型:SYNCHRONOUS DRAM内存宽度:32
湿度敏感等级:3功能数量:1
端口数量:1端子数量:86
字数:2097152 words字数代码:2000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:2MX32
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSOP2封装等效代码:TSSOP86,.46,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度):NOT SPECIFIED电源:2.5 V
认证状态:Not Qualified刷新周期:4096
座面最大高度:1.2 mm自我刷新:YES
连续突发长度:1,2,4,8,FP最大待机电流:0.002 A
子类别:DRAMs最大压摆率:0.12 mA
最大供电电压 (Vsup):2.7 V最小供电电压 (Vsup):2.3 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:10.16 mm
Base Number Matches:1

IS42R32200C1-75TI 数据手册

 浏览型号IS42R32200C1-75TI的Datasheet PDF文件第2页浏览型号IS42R32200C1-75TI的Datasheet PDF文件第3页浏览型号IS42R32200C1-75TI的Datasheet PDF文件第4页浏览型号IS42R32200C1-75TI的Datasheet PDF文件第5页浏览型号IS42R32200C1-75TI的Datasheet PDF文件第6页浏览型号IS42R32200C1-75TI的Datasheet PDF文件第7页 
®
IS42R32200C1  
512K Bits x 32 Bits x 4 Banks (64-MBIT)  
SYNCHRONOUS DYNAMIC RAM  
ISSI  
PRELIMINARY INFORMATION  
DECEMBER 2005  
FEATURES  
OVERVIEW  
ISSI's 64Mb Synchronous DRAM IS42R32200C1 is  
organized as 524,288 bits x 32-bit x 4-bank for improved  
performance. The synchronous DRAMs achieve high-  
speed data transfer using pipeline architecture. All inputs  
and outputs signals refer to the rising edge of the clock  
input.  
• Clock frequency: 133, 100 MHz  
• Fully synchronous; all signals referenced to a  
positive clock edge  
• Internal bank for hiding row access/precharge  
• Single 2.5V power supply  
PIN CONFIGURATION  
(86-Pin TSOP (Type II)  
• LVTTL interface  
• Programmable burst length:  
(1, 2, 4, 8, full page)  
VDD  
DQ0  
VDDQ  
DQ1  
DQ2  
GNDQ  
DQ3  
DQ4  
VDDQ  
DQ5  
DQ6  
GNDQ  
DQ7  
NC  
1
86  
85  
84  
83  
82  
81  
80  
79  
78  
77  
76  
75  
74  
73  
72  
71  
70  
69  
68  
67  
66  
65  
64  
63  
62  
61  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
GND  
DQ15  
GNDQ  
DQ14  
DQ13  
VDDQ  
DQ12  
DQ11  
GNDQ  
DQ10  
DQ9  
VDDQ  
DQ8  
NC  
2
• Programmable burst sequence:  
Sequential/Interleave  
3
4
5
6
• Self refresh modes  
7
8
9
• 4096 refresh cycles every 64 ms  
• Random column address every clock cycle  
• Programmable CAS latency (2, 3 clocks)  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
VDD  
GND  
DQM1  
NC  
• Burst read/write and burst read/single write  
operationscapability  
DQM0  
WE  
CAS  
RAS  
CS  
NC  
CLK  
CKE  
A9  
• Burst termination by burst stop and precharge  
command  
NC  
BA0  
A8  
BA1  
A7  
A10/AP  
A0  
A6  
• Industrialtemperatureavailability  
• Package 400-mil 86-pin TSOP II  
• Lead free package is available  
A5  
A1  
A4  
A2  
A3  
DQM2  
VDD  
DQM3  
GND  
NC  
NC  
DQ16  
GNDQ  
DQ17  
DQ18  
VDDQ  
DQ19  
DQ20  
GNDQ  
DQ21  
DQ22  
VDDQ  
DQ23  
VDD  
DQ31  
VDDQ  
DQ30  
DQ29  
GNDQ  
DQ28  
DQ27  
VDDQ  
DQ26  
DQ25  
GNDQ  
DQ24  
GND  
PIN DESCRIPTIONS  
A0-A10  
BA0, BA1  
DQ0 to DQ31  
CLK  
Address Input  
Bank Select Address  
Data I/O  
System Clock Input  
Clock Enable  
CKE  
CS  
Chip Select  
VDD  
Power  
RAS  
RowAddressStrobeCommand  
Column Address Strobe Command  
WriteEnable  
GND  
VDDQ  
GNDQ  
NC  
Ground  
CAS  
Power Supply for DQ Pin  
Ground for DQ Pin  
NoConnection  
WE  
DQM0 to DQM3 Input/Output Mask  
Copyright © 2005 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time  
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to  
obtain the latest version of this device specification before relying on any published information and before placing orders for products.  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
1
Rev. 00B  
12/14/05  

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