是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | TSSOP | 包装说明: | TSSOP, |
针数: | 8 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.51 |
风险等级: | 5.84 | 最大时钟频率 (fCLK): | 10 MHz |
JESD-30 代码: | R-PDSO-G8 | JESD-609代码: | e3 |
长度: | 4.4 mm | 内存密度: | 131072 bit |
内存集成电路类型: | EEPROM | 内存宽度: | 8 |
功能数量: | 1 | 端子数量: | 8 |
字数: | 16384 words | 字数代码: | 16000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 16KX8 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSSOP |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
并行/串行: | SERIAL | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 串行总线类型: | SPI |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 2.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) - annealed | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | DUAL |
宽度: | 3 mm | 最长写入周期时间 (tWC): | 5 ms |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
IS25C16 | ISSI |
获取价格 |
8K-BIT/16K-BIT SPI SERIAL ELECTRICALLY ERASABLE PROM | |
IS25C16-2CLI | ISSI |
获取价格 |
8K-BIT/16K-BIT SPI SERIAL ELECTRICALLY ERASABLE PROM | |
IS25C16-2DLI | ISSI |
获取价格 |
EEPROM, 2KX8, Serial, CMOS, LEAD FREE, MO-229, DFN-8 | |
IS25C16-2DLI-TR | ISSI |
获取价格 |
EEPROM, 2KX8, Serial, CMOS, LEAD FREE, MO-229, DFN-8 | |
IS25C16-2G | ISSI |
获取价格 |
EEPROM, 2KX8, Serial, CMOS, PDSO8, SOIC-8 | |
IS25C16-2GI | ISSI |
获取价格 |
8K-BIT/16K-BIT SPI SERIAL ELECTRICALLY ERASABLE PROM | |
IS25C16-2GLI | ISSI |
获取价格 |
8K-BIT/16K-BIT SPI SERIAL ELECTRICALLY ERASABLE PROM | |
IS25C16-2PI | ISSI |
获取价格 |
8K-BIT/16K-BIT SPI SERIAL ELECTRICALLY ERASABLE PROM | |
IS25C16-2PLI | ISSI |
获取价格 |
8K-BIT/16K-BIT SPI SERIAL ELECTRICALLY ERASABLE PROM | |
IS25C16-2ZI | ISSI |
获取价格 |
8K-BIT/16K-BIT SPI SERIAL ELECTRICALLY ERASABLE PROM |