是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | TSSOP | 包装说明: | TSSOP, |
针数: | 8 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.51 |
风险等级: | 5.84 | 最大时钟频率 (fCLK): | 5 MHz |
JESD-30 代码: | R-PDSO-G8 | JESD-609代码: | e3 |
长度: | 4.4 mm | 内存密度: | 131072 bit |
内存集成电路类型: | EEPROM | 内存宽度: | 8 |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 8 | 字数: | 16384 words |
字数代码: | 16000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 16KX8 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSSOP | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 并行/串行: | SERIAL |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 串行总线类型: | SPI |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1.8 V |
标称供电电压 (Vsup): | 2.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) - annealed | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 3 mm |
最长写入周期时间 (tWC): | 5 ms | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
IS25C128A-3GLA3 | ISSI |
获取价格 |
EEPROM, 16KX8, Serial, CMOS, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, SOP-8 | |
IS25C128A-3GLI | ISSI |
获取价格 |
128K-bit SPI SERIAL ELECTRICALLY ERASABLE PROM | |
IS25C128A-3PLA3 | ISSI |
获取价格 |
EEPROM, 16KX8, Serial, CMOS, PDIP8, 0.300 INCH, LEAD FREE, PLASTIC DIP-8 | |
IS25C128A-3WLA3 | ISSI |
获取价格 |
EEPROM, 16KX8, Serial, CMOS, PDSO8, 0.200 INCH, LEAD FREE, EIAJ, PLASTIC, SOP-8 | |
IS25C128A-3ZAL3 | ISSI |
获取价格 |
EEPROM, 16KX8, Serial, CMOS, PDSO8, LEAD FREE, MO-153, TSSOP-8 | |
IS25C128A-3ZLI | ISSI |
获取价格 |
128K-bit SPI SERIAL ELECTRICALLY ERASABLE PROM | |
IS25C16 | ISSI |
获取价格 |
8K-BIT/16K-BIT SPI SERIAL ELECTRICALLY ERASABLE PROM | |
IS25C16-2CLI | ISSI |
获取价格 |
8K-BIT/16K-BIT SPI SERIAL ELECTRICALLY ERASABLE PROM | |
IS25C16-2DLI | ISSI |
获取价格 |
EEPROM, 2KX8, Serial, CMOS, LEAD FREE, MO-229, DFN-8 | |
IS25C16-2DLI-TR | ISSI |
获取价格 |
EEPROM, 2KX8, Serial, CMOS, LEAD FREE, MO-229, DFN-8 |