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IS25C08-3GA3 PDF预览

IS25C08-3GA3

更新时间: 2024-09-20 13:54:55
品牌 Logo 应用领域
美国芯成 - ISSI 可编程只读存储器电动程控只读存储器电可擦编程只读存储器时钟光电二极管内存集成电路
页数 文件大小 规格书
14页 67K
描述
EEPROM, 1KX8, Serial, CMOS, PDSO8, SOIC-8

IS25C08-3GA3 技术参数

是否无铅:含铅是否Rohs认证:不符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:SOP, SOP8,.25针数:8
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8542.32.00.51风险等级:5.41
Is Samacsys:N最大时钟频率 (fCLK):5 MHz
数据保留时间-最小值:100耐久性:1000000 Write/Erase Cycles
JESD-30 代码:R-PDSO-G8JESD-609代码:e0
内存密度:8192 bit内存集成电路类型:EEPROM
内存宽度:8功能数量:1
端子数量:8字数:1024 words
字数代码:1000工作模式:SYNCHRONOUS
最高工作温度:125 °C最低工作温度:-40 °C
组织:1KX8封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP8,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
并行/串行:SERIAL峰值回流温度(摄氏度):NOT SPECIFIED
电源:3/5 V认证状态:Not Qualified
串行总线类型:SPI最大待机电流:0.000002 A
子类别:EEPROMs最大压摆率:0.004 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):2.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:AUTOMOTIVE
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED最长写入周期时间 (tWC):5 ms
写保护:HARDWARE/SOFTWAREBase Number Matches:1

IS25C08-3GA3 数据手册

 浏览型号IS25C08-3GA3的Datasheet PDF文件第2页浏览型号IS25C08-3GA3的Datasheet PDF文件第3页浏览型号IS25C08-3GA3的Datasheet PDF文件第4页浏览型号IS25C08-3GA3的Datasheet PDF文件第5页浏览型号IS25C08-3GA3的Datasheet PDF文件第6页浏览型号IS25C08-3GA3的Datasheet PDF文件第7页 
®
IS25C08  
IS25C16  
ISSI  
8K-BIT/16K-BIT SPI SERIAL  
ELECTRICALLY ERASABLE PROM  
AdvancedInformation  
January2005  
FEATURES  
DESCRIPTION  
TheIS25C08andIS25C16areelectricallyerasable  
PROM devices that use the Serial Peripheral Interface  
(SPI) for communications. The IS25C08 is 8Kbit  
(1024x 8) and the IS25C16 is 16Kbit (2048 x 8). The  
IS25C08/16EEPROMsareofferedinwideoperating  
voltages of 1.8V to 5.5V and 2.5V to 5.5V compatible  
with most application voltages. ISSI designed the  
IS25C08/16 to be an efficient SPI EEPROM solution.  
The devices are packaged in 8-pin PDIP, 8-pin SOIC,  
and 8-pin TSSOP.  
• SerialPeripheralInterface(SPI)Compatible  
— Supports SPI Modes 0 (0,0) and 3 (1,1)  
• LowpowerCMOS  
— Active current less than 3.0 mA (2.5V)  
— Standby current less than 1 µA (2.5V)  
• Low-voltageOperation  
— Vcc = 2.5V to 5.5V -3  
— Vcc = 1.8V to 5.5V -2  
• Block Write Protection  
— Protect 1/4, 1/2, or Entire Array  
• 16 byte page write mode  
The functional features of the IS25C08/16 allow them to  
beamongthemostadvancedserialnon-volatilememo-  
ries available. Each device has a Chip-Select (CS) pin,  
and a 3-wire interface of Serial Data In (SI), Serial Data  
Out (SO), and Serial Clock (SCK). While the 3-wire  
interfaceoftheIS25C08/16providesforhigh-speed  
access, a HOLD pin allows the memories to ignore the  
interface in a suspended state; later the HOLD pin re-  
activates communication without re-initializing the serial  
sequence. A Status Register facilitates a flexible write  
— Partial page writes allowed  
• 10 MHz Clock Rate (5V)  
• Self timed write cycles (5 ms Typical)  
• High-reliability  
— Endurance: 1 million cycles per byte  
— Data retention: 100 years  
• 8-pin PDIP, 8-pin SOIC, and 8-pin TSSOP packages  
areavailable  
• Lead-freeavailable  
protectionmechanism,andadevice-readybit(RDY).  
Copyright © 2005 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time  
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to  
obtain the latest version of this device specification before relying on any published information and before placing orders for products.  
Integrated Silicon Solution, Inc. — 1-800-379-4774  
Advanced Information Rev. 00G  
1
01/04/05  

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