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IRLZ44NSLPBF PDF预览

IRLZ44NSLPBF

更新时间: 2024-11-28 01:17:19
品牌 Logo 应用领域
英飞凌 - INFINEON
页数 文件大小 规格书
11页 345K
描述
Logic-Level Gate Drive

IRLZ44NSLPBF 数据手册

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PD - 95156  
IRLZ44NS/LPbF  
HEXFET® Power MOSFET  
l Logic-Level Gate Drive  
l Advanced Process Technology  
l SurfaceMount(IRLZ44NS)  
l Low-profilethrough-hole(IRLZ44NL)  
l 175°C Operating Temperature  
l Fast Switching  
l Fully Avalanche Rated  
l Lead-Free  
Description  
D
VDSS = 55V  
R
DS(on) = 0ꢀ022Ω  
G
ID = 47A  
S
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area" This  
benefit, combined with the fast switching speed and  
ruggedized device design that HEXFET Power MOSFETs  
arewellknownfor, providesthedesignerwithanextremely  
efficient and reliable device for use in a wide variety of  
applications"  
The D2Pak is a surface mount power package capable of  
accommodating die sizes up to HEX-4" It provides the  
highest power capability and the lowest possible on-  
resistance in any existing surface mount package" The  
D2Pak is suitable for high current applications because of  
its low internal connection resistance and can dissipate  
up to 2"0W in a typical surface mount application"  
The through-hole version (IRLZ44NL) is available for low-  
profileapplications"  
2
TO-262  
D
Pak  
Absolute Maximum Ratings  
Parameter  
Maxꢀ  
47  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10Vꢀ  
Continuous Drain Current, VGS @ 10Vꢀ  
Pulsed Drain Current ꢀ  
33  
A
160  
3ꢀ8  
110  
0ꢀ71  
±16  
210  
25  
PD @TA = 25°C  
PD @TC = 25°C  
Power Dissipation  
W
W
Power Dissipation  
Linear Derating Factor  
W/°C  
V
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy‚ꢀ  
Avalanche Current  
mJ  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒꢀ  
Operating Junction and  
11  
mJ  
5ꢀ0  
V/ns  
-55 to + 175  
300 (1ꢀ6mm from case )  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typꢀ  
–––  
Maxꢀ  
1ꢀ4  
Units  
RθJC  
RθJA  
°C/W  
Junction-to-Ambient ( PCB Mounted,steady-state)**  
–––  
40  
4/21/04  

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