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IRLZ24S, IRLZ24L, SiHLZ24S, SiHLZ24L PDF预览

IRLZ24S, IRLZ24L, SiHLZ24S, SiHLZ24L

更新时间: 2024-11-02 14:54:31
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威世 - VISHAY /
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14页 425K
描述
Power MOSFET

IRLZ24S, IRLZ24L, SiHLZ24S, SiHLZ24L 数据手册

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IRLZ24S, IRLZ24L, SiHLZ24S, SiHLZ24L  
www.vishay.com  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Surface-mount  
D
• Available in tape and reel  
• Dynamic dv/dt rating  
• Logic-level gate drive  
• RDS (on) specified at VGS = 4 V and 5 V  
• 175°C operating temperature  
• Fast switching  
I2PAK (TO-262)  
D2PAK (TO-263)  
Available  
Available  
G
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
Note  
D
G
S
D
S
S
G
*
This datasheet provides information about parts that are  
RoHS-compliant and / or parts that are non RoHS-compliant. For  
example, parts with lead (Pb) terminations are not RoHS-compliant.  
Please see the information / tables in this datasheet for details  
N-Channel MOSFET  
PRODUCT SUMMARY  
VDS (V)  
DESCRIPTION  
60  
0.10  
18  
Third generation power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
The D2PAK is a surface-mount power package capable of  
accommodating die sizes up to HEX-4. It provides the  
highest power capability and the lowest possible  
on-resistance in any existing surface-mount package. The  
D2PAK is suitable for high current applications because of  
its low internal connection resistance and can dissipate up  
to 2.0 W in a typical surface-mount application.  
RDS(on) ()  
VGS = 5 V  
Qg max. (nC)  
Q
gs (nC)  
gd (nC)  
4.5  
Q
12  
Configuration  
Single  
The through-hole version (IRLZ24L, SiHLZ24L) is available  
for low profile application.  
ORDERING INFORMATION  
Package  
Lead (Pb)-free and halogen-free  
Lead (Pb)-free  
D2PAK (TO-263)  
SiHLZ24S-GE3  
IRLZ24SPbF  
I2PAK (TO-262)  
SiHLZ24L-GE3  
IRLZ24LPbF  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
60  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
V
VGS  
10  
T
C = 25 °C  
17  
Continuous drain current  
VGS at 5 V  
ID  
TC = 100 °C  
12  
A
Pulsed drain current a  
IDM  
68  
Linear derating factor  
0.40  
0.025  
110  
W/°C  
mJ  
Linear derating factor (PCB mount) e  
Single pulse avalanche energy b  
Maximum power dissipation  
Maximum power dissipation (PCB mount) e  
Peak diode recovery dv/dt c  
EAS  
PD  
T
C = 25 °C  
60  
W
TA = 25 °C  
3.7  
dv/dt  
4.5  
V/ns  
°C  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d  
TJ, Tstg  
-55 to +175  
300  
For 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)  
b. VDD = 25 V, starting TJ = 25 °C, L = 444 μH, Rg = 25 , IAS = 17 A (see fig. 12)  
c. ISD 17 A, di/dt 140 A/μs, VDD VDS, TJ 175 °C  
d. 1.6 mm from case  
e. When mounted on 1" square PCB (FR-4 or G-10 material)  
S20-0684-Rev. D, 07-Sep-2020  
Document Number: 90416  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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