IRLZ24S, IRLZ24L, SiHLZ24S, SiHLZ24L
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
• Surface-mount
D
• Available in tape and reel
• Dynamic dv/dt rating
• Logic-level gate drive
• RDS (on) specified at VGS = 4 V and 5 V
• 175°C operating temperature
• Fast switching
I2PAK (TO-262)
D2PAK (TO-263)
Available
Available
G
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Note
D
G
S
D
S
S
G
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
N-Channel MOSFET
PRODUCT SUMMARY
VDS (V)
DESCRIPTION
60
0.10
18
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The D2PAK is a surface-mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible
on-resistance in any existing surface-mount package. The
D2PAK is suitable for high current applications because of
its low internal connection resistance and can dissipate up
to 2.0 W in a typical surface-mount application.
RDS(on) ()
VGS = 5 V
Qg max. (nC)
Q
gs (nC)
gd (nC)
4.5
Q
12
Configuration
Single
The through-hole version (IRLZ24L, SiHLZ24L) is available
for low profile application.
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
Lead (Pb)-free
D2PAK (TO-263)
SiHLZ24S-GE3
IRLZ24SPbF
I2PAK (TO-262)
SiHLZ24L-GE3
IRLZ24LPbF
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
60
UNIT
Drain-source voltage
Gate-source voltage
VDS
V
VGS
10
T
C = 25 °C
17
Continuous drain current
VGS at 5 V
ID
TC = 100 °C
12
A
Pulsed drain current a
IDM
68
Linear derating factor
0.40
0.025
110
W/°C
mJ
Linear derating factor (PCB mount) e
Single pulse avalanche energy b
Maximum power dissipation
Maximum power dissipation (PCB mount) e
Peak diode recovery dv/dt c
EAS
PD
T
C = 25 °C
60
W
TA = 25 °C
3.7
dv/dt
4.5
V/ns
°C
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d
TJ, Tstg
-55 to +175
300
For 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. VDD = 25 V, starting TJ = 25 °C, L = 444 μH, Rg = 25 , IAS = 17 A (see fig. 12)
c. ISD 17 A, di/dt 140 A/μs, VDD VDS, TJ 175 °C
d. 1.6 mm from case
e. When mounted on 1" square PCB (FR-4 or G-10 material)
S20-0684-Rev. D, 07-Sep-2020
Document Number: 90416
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000