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IRLR4343PBF

更新时间: 2024-11-27 04:23:07
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管脉冲放大器
页数 文件大小 规格书
11页 303K
描述
DIGITAL AUDIO MOSFET

IRLR4343PBF 数据手册

 浏览型号IRLR4343PBF的Datasheet PDF文件第2页浏览型号IRLR4343PBF的Datasheet PDF文件第3页浏览型号IRLR4343PBF的Datasheet PDF文件第4页浏览型号IRLR4343PBF的Datasheet PDF文件第5页浏览型号IRLR4343PBF的Datasheet PDF文件第6页浏览型号IRLR4343PBF的Datasheet PDF文件第7页 
PD - 95394A  
IRLR4343PbF  
DIGITAL AUDIO MOSFET  
IRLU4343PbF  
IRLU4343-701PbF  
Features  
l Advanced Process Technology  
Key Parameters  
l Key Parameters Optimized for Class-D Audio  
Amplifier Applications  
l Low RDSON for Improved Efficiency  
l Low Qg and Qsw for Better THD and Improved  
Efficiency  
l Low Qrr for Better THD and Lower EMI  
l 175°C Operating Junction Temperature for  
Ruggedness  
VDS  
55  
V
m
RDS(ON) typ. @ VGS = 10V  
RDS(ON) typ. @ VGS = 4.5V  
Qg typ.  
42  
m
57  
28  
nC  
°C  
TJ max  
175  
l Repetitive Avalanche Capability for Robustness and  
Reliability  
l Multiple Package Options  
D
l Lead-Free  
D-Pak  
IRLR4343  
I-Pak  
IRLU4343  
G
I-Pak Leadform 701  
IRLU4343-701  
S
Refer to page 10 for package outline  
Description  
This Digital Audio HEXFET® is specifically designed for Class-D audio amplifier applications. This MosFET utilizes the latest  
processing techniques to achieve low on-resistance per silicon area. Furthermore, Gate charge, body-diode reverse recovery  
and internal Gate resistance are optimized to improve key Class-D audio amplifier performance factors such as efficiency, THD  
and EMI. Additional features of this MosFET are 175°C operating junction temperature and repetitive avalanche capability.  
These features combine to make this MosFET a highly efficient, robust and reliable device for Class-D audio amplifier  
applications.  
Absolute Maximum Ratings  
Max.  
Parameter  
Units  
VDS  
55  
Drain-to-Source Voltage  
V
VGS  
±20  
Gate-to-Source Voltage  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
26  
A
19  
80  
79  
PD @TC = 25°C  
PD @TC = 100°C  
Power Dissipation  
W
39  
Power Dissipation  
0.53  
Linear Derating Factor  
W/°C  
°C  
TJ  
-40 to + 175  
Operating Junction and  
Storage Temperature Range  
Clamping Pressure  
TSTG  
–––  
N
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
1.9  
50  
Units  
RθJC  
Junction-to-Case  
Rθ  
Junction-to-Ambient (PCB Mounted)  
Junction-to-Ambient (free air)  
°C/W  
JA  
RθJA  
110  
Notes  through Šare on page 10  
www.irf.com  
1
12/8/04  

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