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IRLR2908TRL PDF预览

IRLR2908TRL

更新时间: 2024-11-05 12:58:35
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英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
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11页 206K
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IRLR2908TRL 数据手册

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PD - 94501  
IRLR2908  
AUTOMOTIVE MOSFET  
IRLU2908  
HEXFET® Power MOSFET  
Features  
D
l
l
l
l
l
l
Advanced Process Technology  
VDSS = 80V  
Ultra Low On-Resistance  
Dynamic dv/dt Rating  
175°C Operating Temperature  
Fast Switching  
RDS(on) = 28mΩ  
G
Repetitive Avalanche Allowed up to Tjmax  
ID = 30A  
S
Description  
Specifically designed for Automotive applications, this HEXFET ® Power MOSFET  
utilizesthelatestprocessingtechniquestoachieveextremelylowon-resistancepersilicon  
area.AdditionalfeaturesofthisHEXFETpowerMOSFETarea175°Cjunctionoperating  
temperature, low RθJC, fast switching speed and improved repetitive avalanche rating.  
Thesefeaturescombinetomakethisdesignanextremelyefficientandreliabledevicefor  
use in Automotive applications and a wide variety of other applications.\  
The D-Pak is designed for surface mounting using vapor phase, infrared, or wave  
solderingtechniques. Thestraightleadversion(IRFUseries)isforthrough-holemounting  
applications. Powerdissipationlevelsupto1.5wattsarepossibleintypicalsurfacemount  
applications.  
I-Pak  
IRLU2908  
D-Pak  
IRLR2908  
Absolute Maximum Ratings  
Parameter  
Max.  
39  
Units  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
I
I
I
I
@ TC = 25°C  
@ TC = 100°C  
@ TC = 25°C  
A
D
D
D
Continuous Drain Current, VGS @ 10V (See Fig. 9)  
28  
(Package Limited)  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
30  
150  
120  
DM  
P
@TC = 25°C  
Maximum Power Dissipation  
W
D
Linear Derating Factor  
Gate-to-Source Voltage  
0.77  
± 16  
W/°C  
V
V
GS  
EAS  
180  
250  
mJ  
Single Pulse Avalanche Energy (Thermally Limited)  
Single Pulse Avalanche Energy Tested Value  
E
AS (tested)  
Avalanche Current  
IAR  
EAR  
See Fig.12a,12b,15,16  
A
Repetitive Avalanche Energy  
mJ  
Peak Diode Recovery dv/dt  
Operating Junction and  
dv/dt  
2.3  
V/ns  
°C  
T
J
-55 to + 175  
T
Storage Temperature Range  
STG  
Soldering Temperature, for 10 seconds  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
1.3  
Units  
RθJC  
RθJA  
RθJA  
Junction-to-Case  
°C/W  
Junction-to-Ambient (PCB Mount)  
40  
Junction-to-Ambient  
110  
www.irf.com  
1
02/13/03  

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