PD - 94501
IRLR2908
AUTOMOTIVE MOSFET
IRLU2908
HEXFET® Power MOSFET
Features
D
l
l
l
l
l
l
Advanced Process Technology
VDSS = 80V
Ultra Low On-Resistance
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
RDS(on) = 28mΩ
G
Repetitive Avalanche Allowed up to Tjmax
ID = 30A
S
Description
Specifically designed for Automotive applications, this HEXFET ® Power MOSFET
utilizesthelatestprocessingtechniquestoachieveextremelylowon-resistancepersilicon
area.AdditionalfeaturesofthisHEXFETpowerMOSFETarea175°Cjunctionoperating
temperature, low RθJC, fast switching speed and improved repetitive avalanche rating.
Thesefeaturescombinetomakethisdesignanextremelyefficientandreliabledevicefor
use in Automotive applications and a wide variety of other applications.\
The D-Pak is designed for surface mounting using vapor phase, infrared, or wave
solderingtechniques. Thestraightleadversion(IRFUseries)isforthrough-holemounting
applications. Powerdissipationlevelsupto1.5wattsarepossibleintypicalsurfacemount
applications.
I-Pak
IRLU2908
D-Pak
IRLR2908
Absolute Maximum Ratings
Parameter
Max.
39
Units
Continuous Drain Current, VGS @ 10V (Silicon Limited)
I
I
I
I
@ TC = 25°C
@ TC = 100°C
@ TC = 25°C
A
D
D
D
Continuous Drain Current, VGS @ 10V (See Fig. 9)
28
(Package Limited)
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
30
150
120
DM
P
@TC = 25°C
Maximum Power Dissipation
W
D
Linear Derating Factor
Gate-to-Source Voltage
0.77
± 16
W/°C
V
V
GS
EAS
180
250
mJ
Single Pulse Avalanche Energy (Thermally Limited)
Single Pulse Avalanche Energy Tested Value
E
AS (tested)
Avalanche Current
IAR
EAR
See Fig.12a,12b,15,16
A
Repetitive Avalanche Energy
mJ
Peak Diode Recovery dv/dt
Operating Junction and
dv/dt
2.3
V/ns
°C
T
J
-55 to + 175
T
Storage Temperature Range
STG
Soldering Temperature, for 10 seconds
300 (1.6mm from case )
Thermal Resistance
Parameter
Typ.
–––
–––
–––
Max.
1.3
Units
RθJC
RθJA
RθJA
Junction-to-Case
°C/W
Junction-to-Ambient (PCB Mount)
40
Junction-to-Ambient
110
www.irf.com
1
02/13/03