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IRLR014NPBF

更新时间: 2024-11-06 03:36:39
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
11页 278K
描述
HEXFET POWER MOSFET ( VDSS = 55V , RDS(on) = 0.14ヘ , ID = 10A )

IRLR014NPBF 数据手册

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PD - 95551A  
IRLR/U014NPbF  
HEXFET® Power MOSFET  
l Logic-Level Gate Drive  
l Surface Mount (IRLR024N)  
l Straight Lead (IRLU024N)  
l Advanced Process Technology  
l Fast Switching  
D
VDSS = 55V  
R
DS(on) = 0.14Ω  
G
l Fully Avalanche Rated  
l Lead-Free  
ID = 10A  
S
Description  
Fifth Generation HEXFETs from International Rectifier utilize advanced  
processing techniques to achieve the lowest possible on-resistance per  
silicon area. This benefit, combined with the fast switching speed and  
ruggedized device design that HEXFET Power MOSFETs are well known for,  
provides the designer with an extremely efficient device for use in a wide  
variety of applications.  
D-Pak  
TO-252AA  
I-Pak  
TO-251AA  
The D-PAK is designed for surface mounting using vapor phase, infrared, or  
wave soldering techniques. The straight lead version (IRFU series) is for  
through-hole mounting applications. Power dissipation levels up to 1.5 watts  
are possible in typical surface mount applications.  
Absolute Maximum Ratings  
Parameter  
Max.  
10  
Units  
ID @ TC = 25°C  
D @ TC = 100°C  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
I
7.1  
40  
A
IDM  
PD @TC = 25°C  
Power Dissipation  
28  
W
W/°C  
V
Linear Derating Factor  
0.2  
± 16  
35  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy‚  
Avalanche Current  
mJ  
A
6.0  
2.8  
5.0  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
mJ  
V/ns  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Junction-to-Case  
Case-to-Ambient (PCB mount)**  
Junction-to-Ambient  
Typ.  
–––  
–––  
–––  
Max.  
5.3  
50  
Units  
RθJC  
RθJA  
RθJA  
°C/W  
110  
** When mounted on 1" square PCB (FR-4 or G-10 Material ) .  
For recommended footprint and soldering techniques refer to application note #AN-994  
www.irf.com  
1
12/06/04  

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