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IRLML2803PBF PDF预览

IRLML2803PBF

更新时间: 2024-11-18 04:23:07
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 297K
描述
HEXFET Power MOSFET

IRLML2803PBF 数据手册

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PD - 94974A  
IRLML2803PbF  
HEXFET® Power MOSFET  
l Generation V Technology  
l Ultra Low On-Resistance  
l N-Channel MOSFET  
l SOT-23 Footprint  
D
VDSS = 30V  
l Low Profile (<1.1mm)  
l Available in Tape and Reel  
l Fast Switching  
G
RDS(on) = 0.25Ω  
S
l Lead-Free  
Description  
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This benefit,  
combined with the fast switching speed and ruggedized  
device design that HEXFET Power MOSFETs are well  
knownfor, providesthedesignerwithanextremelyefficient  
and reliable device for use in a wide variety of applications.  
Micro3  
A customized leadframe has been incorporated into the  
standard SOT-23 package to produce a HEXFET Power  
MOSFET with the industry's smallest footprint. This  
package, dubbed the Micro3, is ideal for applications  
whereprintedcircuitboardspaceisatapremium. Thelow  
profile (<1.1mm) of the Micro3 allows it to fit easily into  
extremely thin application environments such as portable  
electronics and PCMCIA cards.  
Absolute Maximum Ratings  
Parameter  
Max.  
1.2  
Units  
A
I
I
I
@ T = 25°C  
A
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
D
D
@ T = 70°C  
A
0.93  
7.3  
DM  
P
@T = 25°C  
A
540  
mW  
Power Dissipation  
D
Linear Derating Factor  
4.3  
±20  
mW/°C  
V
V
Gate-to-Source Voltage  
GS  
EAS  
3.9  
mJ  
Single Pulse Avalanche Energy  
Peak diode Recovery dv/dt  
Junction and Storage Temperature Range  
5.0  
dv/dt  
V/ns  
°C  
T
T
-55 to + 150  
J , STG  
Thermal Resistance  
Parameter  
Maximum Junction-to-Ambient  
Typ.  
–––  
Max.  
230  
Units  
°C/W  
RθJA  
www.irf.com  
1
04/16/07  

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型号 品牌 替代类型 描述 数据表
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