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IRLML2502GPBF PDF预览

IRLML2502GPBF

更新时间: 2024-09-13 12:20:03
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲光电二极管
页数 文件大小 规格书
8页 180K
描述
HEXFET Power MOSFET

IRLML2502GPBF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:LEAD FREE, MICRO-3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.67
其他特性:HIGH RELIABILITY配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏极电流 (Abs) (ID):4.2 A
最大漏极电流 (ID):4.2 A最大漏源导通电阻:0.045 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-236AB
JESD-30 代码:R-PDSO-G3湿度敏感等级:1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):1.25 W
最大脉冲漏极电流 (IDM):33 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRLML2502GPBF 数据手册

 浏览型号IRLML2502GPBF的Datasheet PDF文件第2页浏览型号IRLML2502GPBF的Datasheet PDF文件第3页浏览型号IRLML2502GPBF的Datasheet PDF文件第4页浏览型号IRLML2502GPBF的Datasheet PDF文件第5页浏览型号IRLML2502GPBF的Datasheet PDF文件第6页浏览型号IRLML2502GPBF的Datasheet PDF文件第7页 
PD - 96163  
IRLML2502GPbF  
HEXFET® Power MOSFET  
l Ultra Low On-Resistance  
l N-Channel MOSFET  
l SOT-23 Footprint  
l Low Profile (<1.1mm)  
l Available in Tape and Reel  
l Fast Switching  
VDSS = 20V  
RDS(on) = 0.045Ω  
l Lead-Free  
l Halogen-Free  
Description  
These N-Channel MOSFETs from International Rectifier  
utilizeadvancedprocessingtechniquestoachieveextremely  
low on-resistance per silicon area. This benefit, combined  
with the fast switching speed and ruggedized device design  
thatHEXFET® powerMOSFETsarewellknownfor,provides  
the designer with an extremely efficient and reliable device  
for use in battery and load management.  
Micro3™  
A thermally enhanced large pad leadframe has been  
incorporated into the standard SOT-23 package to produce  
a HEXFET Power MOSFET with the industry's smallest  
footprint. This package, dubbed the Micro3, is ideal for  
applications where printed circuit board space is at a  
premium. The low profile (<1.1mm) of the Micro3 allows it  
to fit easily into extremely thin application environments  
suchasportableelectronicsandPCMCIAcards.Thethermal  
resistance and power dissipation are the best available.  
Absolute Maximum Ratings  
Parameter  
Drain- Source Voltage  
Max.  
20  
Units  
V
VDS  
ID @ TA = 25°C  
ID @ TA= 70°C  
IDM  
Continuous Drain Current, VGS @ 4.5V  
Continuous Drain Current, VGS @ 4.5V  
Pulsed Drain Current   
4.2  
3.4  
A
33  
PD @TA = 25°C  
PD @TA = 70°C  
Power Dissipation  
1.25  
W
Power Dissipation  
0.8  
Linear Derating Factor  
0.01  
W/°C  
V
VGS  
Gate-to-Source Voltage  
± 12  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to + 150  
°C  
Thermal Resistance  
Parameter  
Typ.  
Max.  
Units  
RθJA  
Maximum Junction-to-Ambientƒ  
75  
100  
°C/W  
www.irf.com  
1
07/22/08  

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