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IRLML0030TRPBF PDF预览

IRLML0030TRPBF

更新时间: 2024-02-19 12:05:19
品牌 Logo 应用领域
TYSEMI 开关
页数 文件大小 规格书
2页 323K
描述
HEXFETpower MOSFET Compatible with existing Surface Mount Techniques Lower switching losses

IRLML0030TRPBF 数据手册

 浏览型号IRLML0030TRPBF的Datasheet PDF文件第2页 
Product specification  
IRLML0030TRPbF  
HEXFET® Power MOSFET  
VDS  
30  
V
V
VGS Max  
± 20  
G
1
RDS(on) max  
(@VGS = 10V)  
27  
40  
m
Ω
3
D
RDS(on) max  
(@VGS = 4.5V)  
TM  
2
S
Micro3 (SOT-23)  
m
Ω
IRLML0030TRPbF  
Application(s)  
Load/ System Switch  
Features and Benefits  
Features  
Benefits  
Low RDS(on) ( 27mΩ)  
Industry-standard pinout  
Lower switching losses  
Multi-vendor compatibility  
results in Easier manufacturing  
Compatible with existing Surface Mount Techniques  
RoHS compliant containing no lead, no bromide and no halogen  
MSL1, Industrial qualification  
Environmentally friendly  
Increased reliability  
Absolute Maximum Ratings  
Symbol  
Parameter  
Max.  
Units  
V
VDS  
30  
5.3  
4.3  
21  
Drain-Source Voltage  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
A
Pulsed Drain Current  
PD @TA = 25°C  
PD @TA = 70°C  
1.3  
0.8  
0.01  
± 20  
Maximum Power Dissipation  
Maximum Power Dissipation  
Linear Derating Factor  
W
W/°C  
V
VGS  
Gate-to-Source Voltage  
TJ, TSTG  
-55 to + 150  
Junction and Storage Temperature Range  
°C  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
–––  
Max.  
100  
Units  
RθJA  
Junction-to-Ambient  
°C/W  
RθJA  
–––  
99  
Junction-to-Ambient (t<10s)  
http://www.twtysemi.com  
sales@twtysemi.com  
1 of 2  

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