IRL540S, SiHL540S
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
• Surface-mount
D
D2PAK (TO-263)
• Available in tape and reel
• Dynamic dv/dt rating
Available
Available
• Repetitive avalanche rated
• Logic-level gate drive
G
• RDS(on) specified at VGS = 4 V and 5 V
• 175 °C operating temperature
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Note
D
G
S
S
N-Channel MOSFET
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
PRODUCT SUMMARY
VDS (V)
100
DESCRIPTION
RDS(on) ()
VGS = 5 V
0.077
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
Qg max. (nC)
64
9.4
Qgs (nC)
gd (nC)
Q
27
The D2PAK (TO-263) is a surface-mount power package
capable of accommodating die size up to HEX-4. It provides
the highest power capability and the lowest possible
on-resistance in any existing surface-mount package. The
D2PAK (TO-263) is suitable for high current applications
because of its low internal connection resistance and can
dissipate up to 2.0 W in a typical surface-mount application.
Configuration
Single
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
Lead (Pb)-free
D2PAK (TO-263)
SiHL540S-GE3
IRL540SPbF
D2PAK (TO-263)
SiHL540STRL-GE3 a
IRL540STRLPbF a
Note
a. See device orientation
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
100
UNIT
Drain-source voltage
Gate-source voltage
VDS
V
VGS
10
TC = 25 °C
C = 100 °C
28
Continuous drain current
VGS at 5 V
ID
T
20
A
Pulsed drain current a
IDM
110
Linear derating factor
1.0
W/°C
Linear derating factor (PCB mount) e
Single pulse avalanche energy b
Avalanche current a
0.025
440
EAS
IAR
mJ
A
28
Repetitive avalanche energy a
Maximum power dissipation
Maximum power dissipation (PCB mount) e
Peak diode recovery dv/dt c
EAR
15
mJ
TC = 25 °C
150
PD
W
V/ns
°C
TA = 25 °C
3.7
dv/dt
5.5
Operating junction and storage temperature range
TJ, Tstg
-55 to +175
300
d
Soldering recommendations (peak temperature)
For 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. VDD = 25 V, starting TJ = 25 °C, L = 841 μH, Rg = 25 , IAS = 28 A (see fig. 12)
c. ISD 28 A, di/dt 170 A/μs, VDD VDS, TJ 175 °C
d. 1.6 mm from case
e. When mounted on 1" square PCB (FR-4 or G-10 material)
S20-0684-Rev. D, 07-Sep-2020
Document Number: 90386
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000