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IRL540NSTRRPBF

更新时间: 2024-10-15 13:08:55
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
8页 253K
描述
Power Field-Effect Transistor, 36A I(D), 100V, 0.053ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, LEAD FREE, PLASTIC, D2PAK-3

IRL540NSTRRPBF 数据手册

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Previous Datasheet  
Index  
Next Data Sheet  
PD - 9.1495  
IRL540N  
HEXFET® Power MOSFET  
PRELIMINARY  
l Logic-Level Gate Drive  
l Advanced Process Technology  
l Isolated Package  
D
VDSS = 100V  
l High Voltage Isolation = 2.5KVRMS  
l Sink to Lead Creepage Dist. = 4.8mm  
l Fully Avalanche Rated  
RDS(on) = 0.044Ω  
G
ID = 30A  
S
Description  
FifthGenerationHEXFETsfromInternationalRectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This  
benefit, combined with the fast switching speed and  
ruggedized device design that HEXFET Power  
MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use  
in a wide variety of applications.  
The TO-220 package is universally preferred for all  
commercial-industrialapplicationsatpowerdissipation  
levels to approximately 50 watts. The low thermal  
resistance and low package cost of the TO-220  
contribute to its wide acceptance throughout the  
industry.  
TO-220AB  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
30  
21  
A
120  
PD @TC = 25°C  
Power Dissipation  
94  
W
W/°C  
V
Linear Derating Factor  
0.63  
± 16  
310  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy‚  
Avalanche Current  
mJ  
A
18  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
9.4  
mJ  
V/ns  
4.3  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 srew  
°C  
300 (1.6mm from case )  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
Max.  
Units  
RθJC  
RθCS  
RθJA  
1.6  
–––  
62  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient  
0.50  
–––  
°C/W  
To Order  
8/14/96  
 
 

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