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IRHYB597Z30CM PDF预览

IRHYB597Z30CM

更新时间: 2024-11-05 11:10:07
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 174K
描述
RADIATION HARDENED POWER MOSFET THRU-HOLE (Low-Ohmic TO-257AA)

IRHYB597Z30CM 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:IN-LINE, R-XSIP-P3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.19
雪崩能效等级(Eas):200 mJ外壳连接:ISOLATED
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:30 V
最大漏极电流 (Abs) (ID):20 A最大漏极电流 (ID):20 A
最大漏源导通电阻:0.072 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
最大反馈电容 (Crss):114 pFJEDEC-95代码:TO-257AA
JESD-30 代码:R-XSIP-P3JESD-609代码:e0
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
最低工作温度:-55 °C封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):75 W最大脉冲漏极电流 (IDM):80 A
认证状态:Not Qualified参考标准:RH - 100K Rad(Si)
子类别:Other Transistors表面贴装:NO
端子面层:Tin/Lead (Sn/Pb)端子形式:PIN/PEG
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
最大关闭时间(toff):120 ns最大开启时间(吨):125 ns
Base Number Matches:1

IRHYB597Z30CM 数据手册

 浏览型号IRHYB597Z30CM的Datasheet PDF文件第2页浏览型号IRHYB597Z30CM的Datasheet PDF文件第3页浏览型号IRHYB597Z30CM的Datasheet PDF文件第4页浏览型号IRHYB597Z30CM的Datasheet PDF文件第5页浏览型号IRHYB597Z30CM的Datasheet PDF文件第6页浏览型号IRHYB597Z30CM的Datasheet PDF文件第7页 
PD-95841A  
RADIATION HARDENED  
POWER MOSFET  
THRU-HOLE (Low-Ohmic TO-257AA)  
IRHYB67130CM  
100V, N-CHANNEL  
TECHNOLOGY  
Product Summary  
Part Number  
Radiation Level RDS(on)  
ID  
IRHYB67130CM 100K Rads (Si) 0.04220A*  
IRHYB63130CM 300K Rads (Si) 0.04220A*  
Low-Ohmic  
TO-257AA  
Tabless  
International Rectifier’s R6TM technology provides  
superior power MOSFETs for space applications.  
These devices have improved immunity to Single  
Event Effect (SEE) and have been characterized for  
useful performance with Linear Energy Transfer  
(LET) up to 90MeV/(mg/cm2). Their combination of  
Features:  
n
n
n
n
n
n
n
n
n
n
Low RDS(on)  
Fast Switching  
Single Event Effect (SEE) Hardened  
Low Total Gate Charge  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Ceramic Eyelets  
very low R  
and faster switching times reduces  
DS(on)  
power loss and increases power density in today’s  
high speed switching applications such as DC-DC  
converters and motor controllers. These devices  
retain all of the well established advantages of  
MOSFETs such as voltage control, ease of paralleling  
and temperature stability of electrical parameters.  
Electrically Isolated  
Light Weight  
Pre-Irradiation  
Absolute Maximum Ratings  
Parameter  
Units  
I
@ V  
@ V  
= 12V, T = 25°C  
Continuous Drain Current  
20*  
19  
D
D
GS  
GS  
C
A
I
= 12V, T = 100°C Continuous Drain Current  
C
I
Pulsed Drain Current À  
Max. Power Dissipation  
Linear Derating Factor  
Gate-to-Source Voltage  
80  
DM  
@ T = 25°C  
P
D
75  
W
W/°C  
V
C
0.6  
V
±20  
107  
20  
GS  
E
Single Pulse Avalanche Energy Á  
Avalanche Current À  
mJ  
A
AS  
I
AR  
E
Repetitive Avalanche Energy À  
Peak Diode Recovery dv/dt   
Operating Junction  
7.5  
mJ  
V/ns  
AR  
dv/dt  
5.5  
T
-55 to 150  
J
oC  
g
T
Storage Temperature Range  
STG  
Lead Temperature  
Weight  
300 (0.063 in. /1.6 mm from case for 10s)  
3.7 (Typical)  
* Current is limited by package  
For footnotes refer to the last page  
www.irf.com  
1
11/18/04  

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