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IRHNJ63234

更新时间: 2024-11-05 03:46:31
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管开关脉冲
页数 文件大小 规格书
8页 188K
描述
RADIATION HARDENED POWER MOSFET SURFACE-MOUNT (SMD-0.5)

IRHNJ63234 技术参数

是否Rohs认证:不符合生命周期:Active
包装说明:SMD-0.5, 3 PINReach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.36
Is Samacsys:N雪崩能效等级(Eas):56 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:250 V最大漏极电流 (Abs) (ID):12.4 A
最大漏极电流 (ID):12.4 A最大漏源导通电阻:0.21 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-CBCC-N3
JESD-609代码:e0元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:RECTANGULAR
封装形式:CHIP CARRIER峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):75 W
最大脉冲漏极电流 (IDM):49.6 A认证状态:Not Qualified
参考标准:RH - 300K Rad(Si)子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
端子形式:NO LEAD端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICON最大关闭时间(toff):90 ns
最大开启时间(吨):55 nsBase Number Matches:1

IRHNJ63234 数据手册

 浏览型号IRHNJ63234的Datasheet PDF文件第2页浏览型号IRHNJ63234的Datasheet PDF文件第3页浏览型号IRHNJ63234的Datasheet PDF文件第4页浏览型号IRHNJ63234的Datasheet PDF文件第5页浏览型号IRHNJ63234的Datasheet PDF文件第6页浏览型号IRHNJ63234的Datasheet PDF文件第7页 
PD-97197  
RADIATION HARDENED  
POWER MOSFET  
SURFACE-MOUNT (SMD-0.5)  
IRHNJ67234  
250V, N-CHANNEL  
TECHNOLOGY  
Product Summary  
Part Number  
IRHNJ67234  
IRHNJ63234  
Radiation Level RDS(on)  
100K Rads (Si) 0.2112.4A  
300K Rads (Si) 0.2112.4A  
ID  
SMD-0.5  
International Rectifier’s R6TM technology provides  
superior power MOSFETs for space applications.  
These devices have improved immunity to Single  
Event Effect (SEE) and have been characterized for  
useful performance with Linear Energy Transfer  
(LET) up to 90MeV/(mg/cm2). Their combination of  
Features:  
n
n
n
n
n
n
n
n
n
n
Low RDS(on)  
Fast Switching  
Single Event Effect (SEE) Hardened  
Low Total Gate Charge  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Surface Mount  
very low R  
and faster switching times reduces  
DS(on)  
power loss and increases power density in today’s  
high speed switching applications such as DC-DC  
converters and motor controllers. These devices  
retain all of the well established advantages of  
MOSFETs such as voltage control, ease of paralleling  
and temperature stability of electrical parameters.  
Ceramic Package  
Light Weight  
Pre-Irradiation  
Absolute Maximum Ratings  
Parameter  
Units  
I
@ V  
@ V  
= 12V, T = 25°C Continuous Drain Current  
12.4  
D
D
GS  
GS  
C
A
I
= 12V, T = 100°C Continuous Drain Current  
7.8  
49.6  
75  
C
I
Pulsed Drain Current À  
Max. Power Dissipation  
Linear Derating Factor  
DM  
@ T = 25°C  
P
W
W/°C  
V
D
C
0.6  
V
Gate-to-Source Voltage  
Single Pulse Avalanche Energy Á  
Avalanche Current À  
±20  
GS  
E
56  
mJ  
A
AS  
I
12.4  
7.5  
AR  
E
AR  
dv/dt  
Repetitive Avalanche Energy À  
Peak Diode Recovery dv/dt   
Operating Junction  
mJ  
V/ns  
5.5  
T
-55 to 150  
J
oC  
g
T
Storage Temperature Range  
STG  
Pckg. Mounting Surface Temp.  
Weight  
300 (for 5s)  
1.0 (Typical)  
For footnotes refer to the last page  
www.irf.com  
1
05/08/06  

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