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IRHG6110SCS PDF预览

IRHG6110SCS

更新时间: 2024-09-16 13:08:51
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管开关脉冲
页数 文件大小 规格书
14页 193K
描述
Power Field-Effect Transistor, 1A I(D), 100V, 0.7ohm, 4-Element, N-Channel and P-Channel, Silicon, Metal-oxide Semiconductor FET, MO-036AB

IRHG6110SCS 数据手册

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PD - 93783E  
IRHG6110  
100V, Combination 2N-2P-CHANNEL  
RAD-HardHEXFET®  
RADIATION HARDENED  
POWER MOSFET  
MOSFET TECHNOLOGY  
THRU-HOLE (MO-036AB)  
Product Summary  
Part Number Radiation Level RDS(on)  
ID  
CHANNEL  
IRHG6110  
IRHG63110  
IRHG6110  
IRHG63110  
100K Rads (Si)  
300K Rads (Si)  
100K Rads (Si)  
0.6Ω  
0.6Ω  
1.1Ω  
1.0A  
N
N
P
P
1.0A  
-0.75A  
-0.75A  
300K Rads (Si) 1.1Ω  
MO-036AB  
International Rectifier’s RAD-HardTM HEXFET® MOSFET  
Technology provides high performance power MOSFETs  
for space applications. This technology has over a decade  
of proven performance and reliability in satellite applica-  
tions. These devices have been characterized for both  
Total Dose and Single Event Effects (SEE). The combina-  
tion of low RDS(on) and low gate charge reduces the power  
losses in switching applications such as DC to DC con-  
verters and motor control. These devices retain all of the  
well established advantages of MOSFETs such as voltage  
control, fast switching, ease of paralleling and tempera-  
ture stability of electrical parameters.  
Features:  
n
n
n
n
n
n
n
n
n
Single Event Effect (SEE) Hardened  
Low RDS(on)  
Low Total Gate Charge  
Proton Tolerant  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Ceramic Package  
Light Weight  
Pre-Irradiation  
Absolute Maximum Ratings (Per Die)  
Parameter  
=± 12V, T = 25°C Continuous Drain Current  
N-Channel  
P-Channel  
-0.75  
-0.5  
Units  
I
@ V  
@ V  
1.0  
D
GS  
C
A
I
=± 12V, T = 100°C Continuous Drain Current  
C
0.6  
D
GS  
I
Pulsed Drain Current  
Max. Power Dissipation  
Linear Derating Factor  
4.0  
-3.0  
DM  
@ T = 25°C  
P
1.4  
1.4  
W
W/°C  
V
D
C
0.011  
±20  
0.011  
±20  
V
Gate-to-Source Voltage  
Single Pulse Avalanche Energy  
Avalanche Current ➀  
GS  
E
56 ➀  
1.0  
75➀  
-0.75  
0.14  
mJ  
A
AS  
I
AR  
E
AR  
dv/dt  
Repetitive Avalanche Energy ➀  
Peak Diode Recovery dv/dt  
Operating Junction  
0.14  
2.4 ➀  
mJ  
V/ns  
2.4 ➀  
T
-55 to 150  
J
T
Storage Temperature Range  
oC  
g
STG  
Lead Temperature  
Weight  
300 (0.63 in./1.6 mm from case for 10s)  
1.3 (Typical)  
For footnotes refer to the last page  
www.irf.com  
1
07/17/01  

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