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IRHF593130SCS PDF预览

IRHF593130SCS

更新时间: 2024-11-05 15:35:23
品牌 Logo 应用领域
英飞凌 - INFINEON 开关脉冲晶体管
页数 文件大小 规格书
8页 203K
描述
Power Field-Effect Transistor, 6.7A I(D), 100V, 0.24ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-205AF, HERMETIC SEALED, CERAMIC, MODIFIED TO-39, 3 PIN

IRHF593130SCS 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:HERMETIC SEALED, CERAMIC, MODIFIED TO-39, 3 PINReach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.8
雪崩能效等级(Eas):240 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:100 V最大漏极电流 (ID):6.7 A
最大漏源导通电阻:0.24 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-205AFJESD-30 代码:O-CBCY-W3
JESD-609代码:e0元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:ROUND
封装形式:CYLINDRICAL峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:P-CHANNEL最大脉冲漏极电流 (IDM):26.8 A
参考标准:RH - 300K Rad(Si)表面贴装:NO
端子面层:TIN LEAD端子形式:WIRE
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRHF593130SCS 数据手册

 浏览型号IRHF593130SCS的Datasheet PDF文件第2页浏览型号IRHF593130SCS的Datasheet PDF文件第3页浏览型号IRHF593130SCS的Datasheet PDF文件第4页浏览型号IRHF593130SCS的Datasheet PDF文件第5页浏览型号IRHF593130SCS的Datasheet PDF文件第6页浏览型号IRHF593130SCS的Datasheet PDF文件第7页 
                                                                         
PD-96963  
RADIATION HARDENED  
POWER MOSFET  
THRU-HOLE (TO-39)  
IRHF597130  
100V, P-CHANNEL  
TECHNOLOGY  
5
™
Product Summary  
Part Number Radiation Level RDS(on)  
ID  
IRHF597130 100K Rads (Si)  
IRHF593130 300K Rads (Si)  
0.24-6.7A  
0.24-6.7A  
TO-39  
International Rectifier’s R5TM technology provides  
high performance power MOSFETs for space appli-  
cations. These devices have been characterized for  
Single Event Effects (SEE) with useful performance  
up to an LET of 80 (MeV/(mg/cm2)). The combination  
of low RDS(on) and low gate charge reduces the power  
losses in switching applications such as DC to DC  
converters and motor control. These devices retain  
all of the well established advantages of MOSFETs  
such as voltage control, fast switching, ease of paral-  
leling and temperature stability of electrical param-  
eters.  
Features:  
n
n
n
n
n
n
n
n
Single Event Effect (SEE) Hardened  
Low RDS(on)  
Low Total Gate Charge  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Ceramic Package  
Light Weight  
Absolute Maximum Ratings  
Pre-Irradiation  
Parameter  
Units  
I
@ V  
@ V  
= -12V, T =25°C Continuous Drain Current  
-6.7  
D
D
GS  
GS  
C
A
I
= -12V, T =100°C Continuous Drain Current  
-4.3  
-26.8  
25  
C
I
Pulsed Drain Current À  
Max. Power Dissipation  
Linear Derating Factor  
DM  
@ T = 25°C  
P
W
W/°C  
V
D
C
0.2  
V
Gate-to-Source Voltage  
Single Pulse Avalanche Energy Á  
Avalanche Current À  
±20  
GS  
E
240  
mJ  
A
AS  
I
-6.7  
AR  
E
Repetitive Avalanche Energy À  
Peak Diode Recovery dv/dt   
Operating Junction  
2.5  
mJ  
V/ns  
AR  
dv/dt  
-17  
T
-55 to 150  
J
oC  
g
T
Storage Temperature Range  
STG  
Lead Temperature  
Weight  
300 (0.063 in./1.6 mm from case for 10s)  
0.98 (Typical )  
For footnotes refer to the last page  
www.irf.com  
1
09/26/05  

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