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IRGC3B60KB

更新时间: 2024-11-26 20:50:35
品牌 Logo 应用领域
英飞凌 - INFINEON 电动机控制晶体管
页数 文件大小 规格书
1页 49K
描述
Insulated Gate Bipolar Transistor, 600V V(BR)CES, N-Channel, DIE-2

IRGC3B60KB 技术参数

是否Rohs认证: 不符合生命周期:Active
Reach Compliance Code:unknown风险等级:5.81
集电极-发射极最大电压:600 V门极发射器阈值电压最大值:5.5 V
极性/信道类型:N-CHANNEL子类别:Insulated Gate BIP Transistors
Base Number Matches:1

IRGC3B60KB 数据手册

  
PD - 94612  
IRGC3B60KB  
Die in Wafer Form  
600V  
Features  
C
• GEN5 Non Punch Through (NPT) Technology  
• Low VCE(on)  
• 10µs Short Circuit Capability  
• Square RBSOA  
IC(nom)= 3.0A  
VCE(on) typ.=1.8V @  
IC(nom) @ 25°C  
• Positive VCE(on) Temperature Coefficient  
MotorControlIGBT  
Short Circuit Rated  
150mm Wafer  
G
Benefits  
• Benchmark Efficiency for Motor Control Applications  
• Rugged Transient Performance  
E
• Excellent Current Sharing in Parallel Operation  
• Qualified for Industrial Market  
Reference Standard IR Package Part: IRGB4B60K  
Electrical Characteristics (Wafer Form)  
Parameter  
VCE (on)  
V(BR)CES  
VGE(th)  
ICES  
Description  
Guaranteed (min, max)  
TestConditions  
Collector-to-Emitter Saturation Voltage  
Colletor-to-Emitter Breakdown Voltage  
Gate Threshold Voltage  
1.18V min, 1.50V max IC = 1A, TJ = 25°C, VGE = 15V  
600V min  
3.5V min, 5.5V max  
10µA max  
TJ = 25°C, ICES = 1mA, VGE = 0V  
VGE = VCE , TJ =25°C, IC = 250µA  
TJ = 25°C, VCE = 600V  
Zero Gate Voltage Collector Current  
Gate-to-Emitter Leakage Current  
IGES  
± 1.1µA max  
TJ = 25°C, VGE = +/-20V  
Mechanical Data  
Nominal Backmetal Composition, (Thickness)  
Nominal Front Metal Composition, (Thickness)  
Dimensions  
Al - Ti - Ni/V - Ag, (1kA - 1kA - 4kA - 6kA)  
99% Al/1% Si, (4µm)  
0.085" x 0.090"  
Wafer Diameter  
150mm, with std. < 100 > flat  
85µm, +/- 7µm  
Wafer Thickness, Tolerance  
Relevant Die Mechanical Dwg. Number  
Minimum Street Width  
01-5554  
100µm  
Reject Ink Dot Size  
0.25mm diameter minimum  
Consistent throughout same wafer lot  
Store in original container, in dessicated  
nitrogen, with no contamination  
For optimum electrical results, die attach  
temperature should not exceed 300°C  
Ink Dot Location  
Recommended Storage Environment  
Recommended Die Attach Conditions  
Die Outline  
2.16  
NOTES:  
[.085]  
1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].  
2. CONTROLLING DIMENSION: [INCH].  
3. LETTER DESIGNATION:  
1.19  
[.047]  
S = SOURCE  
G = GAT E  
SK = SOURCE KELVIN  
IS = CURRENTSENSE  
E = EMITTER  
4. DIMENSIONAL TOLERANCES:  
BONDINGPADS: < 0.635 TOLERANCE  
=
+ /- 0.013  
< [.0250] TOLERANCE = + /- [.0005]  
> 0.635 TOLERANCE + /- 0.025  
EMITTER  
WIDT H  
&
1.24 2.29  
[.048][.090]  
=
LENGTH  
> [.0250] TOLERANCE = + /- [.0010]  
0.64  
GAT E  
[.025]  
OVERALL DIE:  
WIDTH  
< 1.270 TOLERANCE = + /- 0.102  
< [.050] TOLERANCE = + /- [.004]  
> 1.270 TOLERANCE = + /- 0.203  
> [.050] TOLERANCE = + /- [.008]  
&
LENGTH  
0.66  
[.026]  
www.irf.com  
03/03/03  

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