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IRGC14C40LD PDF预览

IRGC14C40LD

更新时间: 2024-11-25 23:58:55
品牌 Logo 应用领域
其他 - ETC 晶体晶体管电视双极性晶体管汽车点火
页数 文件大小 规格书
1页 20K
描述
TRANSISTOR | IGBT | N-CHAN | 430V V(BR)CES | CHIP

IRGC14C40LD 数据手册

  
PD - 94060  
IRGC14C40LB  
IRGC14C40LC  
IRGC14C40LD  
Ignition IGBT  
Die in Wafer Form  
IGBT with on-chip Gate-Emitter and Gate-Collector clamps  
Features  
NOTES: 1) Part number IRGC14C40LB are die in wafer form  
probed and uncut; IRGC14C40LC are die on film probed and  
cut; and IRGC14C40LD are probed die in wafle pack. 2) Refer-  
ence packaged parts are IRGS14C40L, IRGSL14C40L, and  
IRGB14C40L.  
Most Rugged in Industry  
Logic-Level Gate Drive  
> 6KV ESD Gate Protection  
Low Saturation Voltage  
TERMINAL DIAGRAM  
C ollecto r  
High Self-clamped Inductive Switching Energy  
Qualified for the Automotive Qualified [Q101] .  
Description  
The advanced IGBT process family includes a MOS gated,  
N-channel logic level device which is intended for coil-on-plug  
automotive ignition applications and small-engine ignition  
circuits. Unique features include on-chip active voltage  
clamps between the Gate-Emitter and Gate-Collector which  
provide over voltage protection capability in ignition circuits.  
Packaged Characteristics:  
BVCES = 370V min, 430V max  
IC @ TC = 110°C = 14A  
R
1
G ate  
R
2
VCE(on) typ= 1.2V @7A @25°C  
IL(min)=11.5A @25°C,L=4.7mH  
E m itter  
Electrical Characteristics (Wafer Form)  
Parameter  
VCE (on)  
BVCES  
VGE(th)  
ICES  
Description  
Guaranteed (min, max)  
Test Conditions @ TJ = 25°C  
Collector-to-Emitter Saturation Voltage  
Colletor-to-Emitter Breakdown Voltage  
Gate Threshold Voltage  
2.65V max  
IC = 10A, VGE = 4.5V  
370V min, 430V max  
1.2V min, 2.4V max  
10µA max  
RG = 1K ohm, ICES = 25mA, VGE = 0V  
VGE = VCE , IC = 1mA  
Zero Gate Voltage Collector Current  
Gate-to-Emitter Leakage Current  
RG = 1K ohm, VCE = 300V  
IGES  
±0.32mA min, ±1mA max VGE = +/-10V  
TJ  
TSTG  
Operating Junction and Storage  
Temperature Range  
-40°C to 175°C  
Mechanical Data  
Nominal Backmetal Composition, (Thickness)  
Nominal Front Metal Composition, (Thickness)  
Dimensions  
Cr - Ni/V - Ag, (0.1µm - 0.2µm - 0.25µm)  
99% Al/1% Si, (4µm)  
0.141" x 0.164"  
Wafer Diameter  
150mm, with std. < 100 > flat  
.015" +/- .003"  
Wafer Thickness, Tolerance  
Relevant Die Mechanical Dwg. Number  
Minimum Street Width  
01-5467  
100µm  
Reject Ink Dot Size  
0.25mm diameter minimum  
Consistent throughout same wafer lot  
Store in original container, in dessicated  
nitrogen, with no contamination  
For optimum electrical results, die attach  
temperature should not exceed 300°C  
Ink Dot Location  
Recommended Storage Environment  
Recommended Die Attach Conditions  
Die Outline  
NOTES:  
1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].  
2. CONTROLLING DIMENSION: [INCH].  
3. LETTER DESIGNATION:  
3.581  
[.141]  
S = SOURCE  
G = GAT E  
SK = SOURCE KELVIN  
IS = CURRENTSENSE  
E = EMITTER  
0.932  
[.037]  
0.943  
[.037]  
4. DIMENSIONAL TOLERANCES:  
BONDING PADS:  
WIDT H  
<
<
>
>
0.635 TOLERANCE  
[.0250] TOLERANCE = + /- [.0005]  
0.635 TOLERANCE + /- 0.025  
[.0250] TOLERANCE = + /- [.0010]  
= + /- 0.013  
E
&
=
LENGTH  
OVERALL DIE:  
WIDT H  
<
<
>
>
1.270 TOLERANCE  
[.050] TOLERANCE = + /- [.004]  
1.270 TOLERANCE + /- 0.203  
[.050] TOLERANCE = + /- [.008]  
= + /- 0.102  
4.166  
[.164]  
&
=
LENGTH  
G
0.562  
[.022]  
0.762  
[.030]  
www.irf.com  
12/19/00  

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