PD - 94060
IRGC14C40LB
IRGC14C40LC
IRGC14C40LD
Ignition IGBT
Die in Wafer Form
IGBT with on-chip Gate-Emitter and Gate-Collector clamps
Features
NOTES: 1) Part number IRGC14C40LB are die in wafer form
probed and uncut; IRGC14C40LC are die on film probed and
cut; and IRGC14C40LD are probed die in wafle pack. 2) Refer-
ence packaged parts are IRGS14C40L, IRGSL14C40L, and
IRGB14C40L.
•Most Rugged in Industry
•Logic-Level Gate Drive
•> 6KV ESD Gate Protection
•Low Saturation Voltage
TERMINAL DIAGRAM
C ollecto r
•High Self-clamped Inductive Switching Energy
•Qualified for the Automotive Qualified [Q101] .
Description
The advanced IGBT process family includes a MOS gated,
N-channel logic level device which is intended for coil-on-plug
automotive ignition applications and small-engine ignition
circuits. Unique features include on-chip active voltage
clamps between the Gate-Emitter and Gate-Collector which
provide over voltage protection capability in ignition circuits.
Packaged Characteristics:
•BVCES = 370V min, 430V max
•IC @ TC = 110°C = 14A
R
1
G ate
R
2
•VCE(on) typ= 1.2V @7A @25°C
•IL(min)=11.5A @25°C,L=4.7mH
E m itter
Electrical Characteristics (Wafer Form)
Parameter
VCE (on)
BVCES
VGE(th)
ICES
Description
Guaranteed (min, max)
Test Conditions @ TJ = 25°C
Collector-to-Emitter Saturation Voltage
Colletor-to-Emitter Breakdown Voltage
Gate Threshold Voltage
2.65V max
IC = 10A, VGE = 4.5V
370V min, 430V max
1.2V min, 2.4V max
10µA max
RG = 1K ohm, ICES = 25mA, VGE = 0V
VGE = VCE , IC = 1mA
Zero Gate Voltage Collector Current
Gate-to-Emitter Leakage Current
RG = 1K ohm, VCE = 300V
IGES
±0.32mA min, ±1mA max VGE = +/-10V
TJ
TSTG
Operating Junction and Storage
Temperature Range
-40°C to 175°C
Mechanical Data
Nominal Backmetal Composition, (Thickness)
Nominal Front Metal Composition, (Thickness)
Dimensions
Cr - Ni/V - Ag, (0.1µm - 0.2µm - 0.25µm)
99% Al/1% Si, (4µm)
0.141" x 0.164"
Wafer Diameter
150mm, with std. < 100 > flat
.015" +/- .003"
Wafer Thickness, Tolerance
Relevant Die Mechanical Dwg. Number
Minimum Street Width
01-5467
100µm
Reject Ink Dot Size
0.25mm diameter minimum
Consistent throughout same wafer lot
Store in original container, in dessicated
nitrogen, with no contamination
For optimum electrical results, die attach
temperature should not exceed 300°C
Ink Dot Location
Recommended Storage Environment
Recommended Die Attach Conditions
Die Outline
NOTES:
1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].
2. CONTROLLING DIMENSION: [INCH].
3. LETTER DESIGNATION:
3.581
[.141]
S = SOURCE
G = GAT E
SK = SOURCE KELVIN
IS = CURRENTSENSE
E = EMITTER
0.932
[.037]
0.943
[.037]
4. DIMENSIONAL TOLERANCES:
BONDING PADS:
WIDT H
<
<
>
>
0.635 TOLERANCE
[.0250] TOLERANCE = + /- [.0005]
0.635 TOLERANCE + /- 0.025
[.0250] TOLERANCE = + /- [.0010]
= + /- 0.013
E
&
=
LENGTH
OVERALL DIE:
WIDT H
<
<
>
>
1.270 TOLERANCE
[.050] TOLERANCE = + /- [.004]
1.270 TOLERANCE + /- 0.203
[.050] TOLERANCE = + /- [.008]
= + /- 0.102
4.166
[.164]
&
=
LENGTH
G
0.562
[.022]
0.762
[.030]
www.irf.com
12/19/00