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IRG4PC50S-EPBF PDF预览

IRG4PC50S-EPBF

更新时间: 2024-11-02 13:08:51
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管
页数 文件大小 规格书
8页 148K
描述
Insulated Gate Bipolar Transistor, 70A I(C), 600V V(BR)CES, N-Channel, TO-247AD, TO-247AD, 3 PIN

IRG4PC50S-EPBF 技术参数

是否Rohs认证:符合生命周期:Active
包装说明:FLANGE MOUNT, R-PSFM-T3Reach Compliance Code:compliant
风险等级:5.53Is Samacsys:N
其他特性:STANDARD SPEED外壳连接:COLLECTOR
最大集电极电流 (IC):70 A集电极-发射极最大电压:600 V
配置:SINGLEJEDEC-95代码:TO-247AD
JESD-30 代码:R-PSFM-T3JESD-609代码:e3
元件数量:1端子数量:3
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL认证状态:Not Qualified
表面贴装:NO端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:POWER CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):1700 ns
标称接通时间 (ton):62 nsBase Number Matches:1

IRG4PC50S-EPBF 数据手册

 浏览型号IRG4PC50S-EPBF的Datasheet PDF文件第2页浏览型号IRG4PC50S-EPBF的Datasheet PDF文件第3页浏览型号IRG4PC50S-EPBF的Datasheet PDF文件第4页浏览型号IRG4PC50S-EPBF的Datasheet PDF文件第5页浏览型号IRG4PC50S-EPBF的Datasheet PDF文件第6页浏览型号IRG4PC50S-EPBF的Datasheet PDF文件第7页 
PD 91468C  
IRG4PC50F  
Fast Speed IGBT  
INSULATED GATE BIPOLAR TRANSISTOR  
C
Features  
Optimized for medium operating  
frequencies ( 1-5 kHz in hard switching, >20  
kHz in resonant mode).  
VCES =600V  
Generation 4 IGBT design provides tighter  
parameter distribution and higher efficiency than  
Generation 3  
V
CE(on) typ. = 1.45V  
G
@VGE = 15V, IC = 39A  
E
Industry standard TO-247AC package  
n-channel  
Benefits  
Generation 4 IGBT's offer highest efficiency available  
IGBT's optimized for specified application conditions  
Designed to be a "drop-in" replacement for equivalent  
industry-standard Generation 3 IR IGBT's  
TO-247AC  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VCES  
Collector-to-Emitter Breakdown Voltage  
Continuous Collector Current  
Continuous Collector Current  
Pulsed Collector Current   
600  
V
IC @ TC = 25°C  
70  
IC @ TC = 100°C  
39  
280  
A
ICM  
ILM  
Clamped Inductive Load Current ‚  
Gate-to-Emitter Voltage  
280  
VGE  
± 20  
V
EARV  
Reverse Voltage Avalanche Energy ƒ  
Maximum Power Dissipation  
20  
mJ  
PD @ TC = 25°C  
200  
W
PD @ TC = 100°C  
Maximum Power Dissipation  
78  
TJ  
Operating Junction and  
-55 to + 150  
TSTG  
Storage Temperature Range  
°C  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 screw.  
300 (0.063 in. (1.6mm from case )  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
Max.  
0.64  
–––  
40  
Units  
°C/W  
RθJC  
RθCS  
RθJA  
Wt  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient, typical socket mount  
Weight  
0.24  
–––  
6 (0.21)  
–––  
g (oz)  
www.irf.com  
1
12/30/00  

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