PD - 94823
IRFZ44RPbF
HEXFET® Power MOSFET
l Advanced Process Technology
l Ultra Low On-Resistance
l Dynamic dv/dt Rating
l 175°C Operating Temperature
l Fast Switching
l Fully Avalanche Rated
l Drop in Replacement of the IRFZ44
for Linear/Audio Applications
l Lead-Free
D
VDSS = 60V
RDS(on) = 0.028Ω
G
ID = 50*A
S
Description
Advanced HEXFET® Power MOSFETs from International
Rectifier utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized device
design that HEXFET power MOSFETs are well known for,
provides the designer with an extremely efficient and reliable
device for use in a wide variety of applications.
TheTO-220packageisuniversallypreferredforallcommercial-
industrial applications at power dissipation levels to
approximately 50 watts. The low thermal resistance and low
package cost of the TO-220 contribute to its wide acceptance
throughout the industry.
TO-220AB
Absolute Maximum Ratings
Parameter
Max.
50*
36
Units
ID @ TC = 25°C
ID @ TC = 100°C
IDM
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
A
200
PD @TC = 25°C
Power Dissipation
150
W
W/°C
V
Linear Derating Factor
1.0
VGS
EAS
dv/dt
TJ
Gate-to-Source Voltage
±20
Single Pulse Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
100
mJ
4.5
V/ns
-55 to + 175
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting Torque, 6-32 or M3 screw
°C
300 (1.6mm from case )
10 lbf•in (1.1 N•m)
Thermal Resistance
Parameter
Junction-to-Case
Typ.
–––
Max.
1.0
Units
RθJC
RθCS
RθJA
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
0.50
–––
–––
62
°C/W
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1
11/10/03