IRFZ14S, SiHFZ14S, SiHFZ14L
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
D
• Advanced process technology
• Surface-mount (IRFZ14S, SiHFZ14S)
• Low profile through-hole (SiHFZ14L)
• 175 °C operating temperature
• Fast switching
I2PAK (TO-262)
D2PAK (TO-263)
Available
Available
G
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
D
G
Note
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
S
*
D
S
S
G
N-Channel MOSFET
DESCRIPTION
Third generation power MOSFETs from Vishay utilize
advanced processing techniques to achieve extremely low
on resistance per silicon area. This benefit, combined with
the fast switching speed and ruggedized device design that
power MOSFETs are well known for, provides the designer
with an extremely efficient reliable device for use in a wide
variety of applications.
The D2PAK (TO-263) is a surface-mount power package
capable of accommodating die sizes up to HEX-4. It
provides the highest power capability and lowest possible
on-resistance in any existing surface-mount package. The
D2PAK (TO-263) is suitable for high current applications
because of its low internal connection resistance and can
dissipate up to 2.0 W in a typical surface-mount application.
PRODUCT SUMMARY
VDS (V)
60
0.20
11
RDS(on) ()
VGS = 10 V
Qg max. (nC)
Q
gs (nC)
gd (nC)
3.1
Q
5.8
Configuration
Single
The through-hole version (SiHFZ44L) is available for low
profile applications.
ORDERING INFORMATION
Package
D2PAK (TO-263)
D2PAK (TO-263)
SiHFZ14STRL-GE3 a
IRFZ14STRLPbF a
I2PAK (TO-262)
SiHFZ14L-GE3
-
Lead (Pb)-free and halogen-free
Lead (Pb)-free
SiHFZ14S-GE3
IRFZ14SPbF
Note
a. See device orientation
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-source voltage
Gate-source voltage
VDS
60
20
V
VGS
T
C = 25 °C
10
Continuous drain current
VGS at 10 V
ID
TC = 100 °C
7.2
A
Pulsed drain current a
IDM
40
Linear derating factor
Single pulse avalanche energy b
0.29
47
W/°C
mJ
EAS
PD
Maximum power dissipation
T
C = 25 °C
43
W
V/ns
°C
Maximum power dissipation (PCB mount) e
Peak diode recovery dv/dt c
TA = 25 °C
3.7
dv/dt
4.5
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d
TJ, Tstg
-55 to +175
300
For 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. VDD = 25 V, starting TJ = 25 °C, L = 548 μH, Rg = 25 , IAS = 10 A (see fig. 12)
c. ISD 10 A, di/dt 90 A/μs, VDD VDS, TJ 175 °C
d. 1.6 mm from case
e. When mounted on 1" square PCB (FR-4 or G-10 material)
S20-0684-Rev. D, 07-Sep-2020
Document Number: 90365
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000