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IRFZ14S, SiHFZ14S, SiHFZ14L PDF预览

IRFZ14S, SiHFZ14S, SiHFZ14L

更新时间: 2024-11-22 14:55:15
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
11页 377K
描述
Power MOSFET

IRFZ14S, SiHFZ14S, SiHFZ14L 数据手册

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IRFZ14S, SiHFZ14S, SiHFZ14L  
www.vishay.com  
Vishay Siliconix  
Power MOSFET  
FEATURES  
D
• Advanced process technology  
• Surface-mount (IRFZ14S, SiHFZ14S)  
• Low profile through-hole (SiHFZ14L)  
• 175 °C operating temperature  
• Fast switching  
I2PAK (TO-262)  
D2PAK (TO-263)  
Available  
Available  
G
• Material categorization: for definitions of  
compliance please see www.vishay.com/doc?99912  
D
G
Note  
This datasheet provides information about parts that are  
RoHS-compliant and / or parts that are non RoHS-compliant. For  
example, parts with lead (Pb) terminations are not RoHS-compliant.  
Please see the information / tables in this datasheet for details  
S
*
D
S
S
G
N-Channel MOSFET  
DESCRIPTION  
Third generation power MOSFETs from Vishay utilize  
advanced processing techniques to achieve extremely low  
on resistance per silicon area. This benefit, combined with  
the fast switching speed and ruggedized device design that  
power MOSFETs are well known for, provides the designer  
with an extremely efficient reliable device for use in a wide  
variety of applications.  
The D2PAK (TO-263) is a surface-mount power package  
capable of accommodating die sizes up to HEX-4. It  
provides the highest power capability and lowest possible  
on-resistance in any existing surface-mount package. The  
D2PAK (TO-263) is suitable for high current applications  
because of its low internal connection resistance and can  
dissipate up to 2.0 W in a typical surface-mount application.  
PRODUCT SUMMARY  
VDS (V)  
60  
0.20  
11  
RDS(on) ()  
VGS = 10 V  
Qg max. (nC)  
Q
gs (nC)  
gd (nC)  
3.1  
Q
5.8  
Configuration  
Single  
The through-hole version (SiHFZ44L) is available for low  
profile applications.  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
D2PAK (TO-263)  
SiHFZ14STRL-GE3 a  
IRFZ14STRLPbF a  
I2PAK (TO-262)  
SiHFZ14L-GE3  
-
Lead (Pb)-free and halogen-free  
Lead (Pb)-free  
SiHFZ14S-GE3  
IRFZ14SPbF  
Note  
a. See device orientation  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
60  
20  
V
VGS  
T
C = 25 °C  
10  
Continuous drain current  
VGS at 10 V  
ID  
TC = 100 °C  
7.2  
A
Pulsed drain current a  
IDM  
40  
Linear derating factor  
Single pulse avalanche energy b  
0.29  
47  
W/°C  
mJ  
EAS  
PD  
Maximum power dissipation  
T
C = 25 °C  
43  
W
V/ns  
°C  
Maximum power dissipation (PCB mount) e  
Peak diode recovery dv/dt c  
TA = 25 °C  
3.7  
dv/dt  
4.5  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d  
TJ, Tstg  
-55 to +175  
300  
For 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)  
b. VDD = 25 V, starting TJ = 25 °C, L = 548 μH, Rg = 25 , IAS = 10 A (see fig. 12)  
c. ISD 10 A, di/dt 90 A/μs, VDD VDS, TJ 175 °C  
d. 1.6 mm from case  
e. When mounted on 1" square PCB (FR-4 or G-10 material)  
S20-0684-Rev. D, 07-Sep-2020  
Document Number: 90365  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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