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IRFU9214 PDF预览

IRFU9214

更新时间: 2024-11-08 22:51:39
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
10页 108K
描述
Power MOSFET(Vdss=-250V, Rds(on)=3.0ohm, Id=-2.7A)

IRFU9214 数据手册

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PD - 9.1658A  
IRFR/U9214  
PRELIMINARY  
HEXFET® Power MOSFET  
D
l P-Channel  
VDSS = -250V  
RDS(on) = 3.0Ω  
ID = -2.7A  
l Surface Mount (IRFR9214)  
l Straight Lead (IRFU9214)  
l Advanced Process Technology  
l Fast Switching  
G
l Fully Avalanche Rated  
S
Description  
Third Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve low  
on-resistance per silicon area. This benefit, combined  
with the fast switching speed and ruggedized device  
design that HEXFET Power MOSFETs are well known for,  
provides the designer with an extremely efficient and  
reliable device for use in a wide variety of applications.  
I-Pa k  
D -Pa k  
T O -2 52 A A  
TO -2 5 1 AA  
The D-Pak is designed for surface mounting using vapor  
phase, infrared, orwavesolderingtechniques. Thestraight  
lead version (IRFU series) is for through-hole mounting  
applications. Power dissipation levels up to 1.5 watts are  
possible in typical surface mount applications.  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ -10V  
Continuous Drain Current, VGS @ -10V  
Pulsed Drain Current   
-2.7  
-1.7  
A
-11  
PD @TC = 25°C  
Power Dissipation  
50  
W
W/°C  
V
Linear Derating Factor  
0.40  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
± 20  
Single Pulse Avalanche Energy‚  
Avalanche Current  
100  
mJ  
-2.7  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
5.0  
mJ  
-5.0  
V/ns  
-55 to + 150  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
260 (1.6mm from case )  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
–––  
–––  
Max.  
2.5  
50  
Units  
RθJC  
RθJA  
RθJA  
Junction-to-Ambient (PCB mount)**  
Junction-to-Ambient  
°C/W  
110  
9/23/97  

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