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IRFU9214 PDF预览

IRFU9214

更新时间: 2024-11-05 12:33:43
品牌 Logo 应用领域
科盛美 - KERSEMI 晶体晶体管开关脉冲局域网
页数 文件大小 规格书
7页 3394K
描述
Power MOSFET

IRFU9214 数据手册

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IRFR9214, IRFU9214, SiHFR9214, SiHFU9214  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
• P-Channel  
- 250  
Available  
• Surface Mount (IRFR9214/SiHFR9214)  
RDS(on) (Ω)  
VGS = - 10 V  
3.0  
• Straight Lead (IRFU9214/SiHFU9214)  
• Advanced Process Technology  
• Fast Switching  
RoHS*  
COMPLIANT  
Qg (Max.) (nC)  
14  
3.1  
Q
Q
gs (nC)  
gd (nC)  
6.8  
• Fully Avalanche Rated  
Configuration  
Single  
• Lead (Pb)-free Available  
S
DESCRIPTION  
Third generation Power MOSFETs from Vishay utilize  
advanced processing techniques to achieve low  
on-resistance per silicon area. This benefit, combined with  
the fast switching speed and ruggedized device design that  
Power MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use in a  
wide variety of applications.  
The DPAK is designed for surface mounting using vapor  
phase, infrared, or wave soldering techniques. The straight  
lead version (IRFU/SiHFU series) is for through-hole  
mounting applications. Power dissipation levels up to 1.5 W  
are possible in typical surface mount applications.  
DPAK  
(TO-252)  
IPAK  
(TO-251)  
G
D
P-Channel MOSFET  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
DPAK (TO-252)  
DPAK (TO-252)  
IRFR9214TRPbFa  
SiHFR9214T-E3a  
IRFR9214TRa  
IPAK (TO-251)  
IRFU9214PbF  
SiHFU9214-E3  
IRFU9214  
IRFR9214PbF  
SiHFR9214-E3  
IRFR9214  
IRFR9214TRLPbFa  
SiHFR9214TL-E3a  
IRFR9214TRLa  
Lead (Pb)-free  
SnPb  
SiHFR9214  
SiHFR9214TLa  
SiHFR9214Ta  
SiHFU9214  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
- 250  
20  
V
VGS  
TC = 25 °C  
TC =100°C  
- 2.7  
Continuous Drain Current  
VGS at - 10 V  
ID  
- 1.7  
- 11  
A
Pulsed Drain Currenta  
IDM  
Linear Derating Factor  
0.40  
W/°C  
mJ  
A
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
Repetitive Avalanche Energya  
EAS  
IAR  
100  
- 2.7  
EAR  
5.0  
mJ  
W
Maximum Power Dissipation  
T
C = 25 °C  
PD  
50  
Peak Diode Recovery dV/dtc  
dV/dt  
TJ, Tstg  
- 5.0  
- 55 to + 150  
260d  
V/ns  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
°C  
for 10 s  
www.kersemi.com  
1

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