IRFR9210, IRFU9210, SiHFR9210, SiHFU9210
Power MOSFET
FEATURES
• Dynamic dV/dt Rating
PRODUCT SUMMARY
VDS (V)
- 200
Available
• Repetitive Avalanche Rated
RDS(on) (Ω)
VGS = - 10 V
3.0
RoHS*
• Surface Mount (IRFR9210/SiHFR9210)
• Straight Lead (IRFU9210/SiHFU9210)
• Available in Tape and Reel
• P-Channel
Qg (Max.) (nC)
8.9
2.1
COMPLIANT
Q
Q
gs (nC)
gd (nC)
3.9
Configuration
Single
• Fast Switching
S
• Lead (Pb)-free Available
DPAK
(TO-252)
IPAK
(TO-251)
DESCRIPTION
G
The Power MOSFETs technology is the key to Vishay’s
advanced line of Power MOSFET transistors. The efficient
geometry and unique processing of the Power MOSFET
design achieve very low on-state resistance combined with
high transconductance and extreme device ruggedness.
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU/SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.
D
P-Channel MOSFET
ORDERING INFORMATION
Package
DPAK (TO-252)
DPAK (TO-252)
DPAK (TO-252)
-
IPAK (TO-251)
IRFU9210PbF
SiHFU9210-E3
IRFU9210
IRFR9210PbF
SiHFR9210-E3
IRFR9210
IRFR9210TRPbFa
SiHFR9210T-E3a
IRFR9210TRa
Lead (Pb)-free
-
IRFR9210TRLa
SiHFR9210TLa
SnPb
SiHFR9210
SiHFR9210Ta
SiHFU9210
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
- 200
20
V
TC = 25 °C
TC =100°C
- 1.9
- 1.2
- 7.6
0.20
0.020
300
Continuous Drain Current
V
GS at - 10 V
ID
A
Pulsed Drain Currenta
Linear Derating Factor
IDM
W/°C
Linear Derating Factor (PCB Mount)e
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
EAS
IAR
EAR
mJ
A
mJ
- 1.9
2.5
Repetitive Avalanche Energya
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)e
Peak Diode Recovery dV/dtc
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
TC = 25 °C
TA = 25 °C
25
2.5
PD
W
V/ns
°C
dV/dt
TJ, Tstg
- 5.0
- 55 to + 150
260d
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = - 50 V, starting TJ = 25 °C, L = 124 mH, RG = 25 Ω, IAS = - 1.9 A (see fig. 12).
c. ISD ≤ - 1.9 A, dI/dt ≤ 70 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
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