IRFR9014, IRFU9014, SiHFR9014, SiHFU9014
Power MOSFET
FEATURES
• Dynamic dV/dt Rating
PRODUCT SUMMARY
VDS (V)
- 60
Available
• Repetitive Avalanche Rated
RDS(on) (Ω)
VGS = - 10 V
0.50
RoHS*
• Surface Mount (IRFR9014/SiHFR9014)
COMPLIANT
Qg (Max.) (nC)
12
• Straight Lead (IRFU9014/SiHFU9014)
Q
gs (nC)
3.8
• Available in Tape and Reel
Qgd (nC)
5.1
• P-Channel
Configuration
Single
• Fast Switching
S
• Lead (Pb)-free Available
DESCRIPTION
DPAK
IPAK
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
(TO-252)
(TO-251)
G
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU/SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
D
P-Channel MOSFET
are possible in typical surface mount applications.
ORDERING INFORMATION
Package
DPAK (TO-252)
DPAK (TO-252)
IRFR9014TRLPbFa
SiHFR9014TL-E3a
IRFR9014TRLa
SiHFR9014TLa
DPAK (TO-252)
IRFR9014TRPbFa
SiHFR9014T-E3a
IRFR9014TRa
IPAK (TO-251)
IRFU9014PbF
SiHFU9014-E3
IRFU9014
IRFR9014PbF
SiHFR9014-E3
IRFR9014
Lead (Pb)-free
SnPb
SiHFR9014
SiHFR9014Ta
SiHFU9014
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
- 60
20
V
VGS
T
C = 25 °C
- 5.1
- 3.2
- 20
Continuous Drain Current
VGS at 5.0 V
ID
TC =100°C
A
Pulsed Drain Currenta
IDM
Linear Derating Factor
0.20
W/°C
Linear Derating Factor (PCB Mount)e
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
Repetitive Avalanche Energya
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)e
Peak Diode Recovery dV/dtc
0.020
140
EAS
IAR
mJ
A
- 5.1
2.5
EAR
mJ
TC = 25 °C
25
PD
W
TA = 25 °C
2.5
dV/dt
- 4.5
- 55 to + 150
V/ns
Operating Junction and Storage Temperature Range
TJ, Tstg
°C
Soldering Recommendations (Peak Temperature)
for 10 s
260d
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = - 25 V, starting TJ = 25 °C, L = 6.3 mH, RG = 25 Ω, IAS = - 5.1 A (see fig. 12).
c. ISD ≤ - 6.7 A, dI/dt ≤ 90 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
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