IRFR9010, IRFU9010, SiHFR9010, SiHFU9010
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
• Surface Mountable (Order as IRFR9010,
SiHFR9010)
VDS (V)
DS(on) ()
Qg (Max.) (nC)
- 50
• Straight Lead Option (Order as IRFU9010,
R
VGS = - 10 V
0.50
SiHFU9010)
9.1
3.0
5.9
• Repetitive Avalanche Ratings
• Dynamic dV/dt Rating
Q
gs (nC)
gd (nC)
• Simple Drive Requirements
• Ease of Paralleling
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
Q
Configuration
Single
S
DESCRIPTION
The power MOSFET technology is the key to Vishay’s
advanced line of power MOSFET transistors. The efficient
geometry and unique processing of this latest “State of the
Art” design achieves: very low on-state resistance
combined with high transconductance; superior reverse
energy and diode recovery dV/dt capability.
The power MOSFET transistors also feature all of the well
established advantages of MOSFETs such as voltage
control, very fast switching, ease of paralleling and
temperature stability of the electrical parameters.
DPAK
(TO-252)
IPAK
(TO-251)
G
D
D
S
G
S
D
G
D
P-Channel MOSFET
Surface mount packages enhance circuit performance by
reducing stray inductances and capacitance. The DPAK
(TO-252) surface mount package brings the advantages of
power MOSFETs to high volume applications where PC
Board surface mounting is desirable. The surface mount
option IRFR9010, SiHFR9010 is provided on 16 mm tape.
The straight lead option IRFU9010, SiHFU9010 of the device
is called the IPAK (TO-251).
They are well suited for applications where limited heat
dissipation is required such as, computers and peripherals,
telecommunication equipment, DC/DC converters, and a
wide range of consumer products.
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
DPAK (TO-252)
SiHFR9010-GE3
IRFR9010PbF
SiHFR9010-E3
DPAK (TO-252)
DPAK (TO-252)
IPAK (TO-251)
SiHFU9010-GE3
IRFU9010PbF
SiHFU9010-E3
SiHFR9010TR-GE3a
IRFR9010TRPbFa
SiHFR9010T-E3a
SiHFR9010TRL-GE3a
IRFR9010TRLPbFa
SiHFR9010TL-E3a
Lead (Pb)-free
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
- 50
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
V
VGS
20
TC = 25 °C
C = 100 °C
- 5.3
- 3.3
- 21
Continuous Drain Current
VGS at - 10 V
ID
T
A
Pulsed Drain Currenta
IDM
Linear Derating Factor
0.20
136
W/°C
mJ
A
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
Repetitive Avalanche Energya
EAS
IAR
- 5.3
2.5
EAR
mJ
W
Maximum Power Dissipation
T
C = 25 °C
PD
25
Peak Diode Recovery dV/dtc
dV/dt
TJ, Tstg
5.8
V/ns
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d
- 55 to + 150
300
°C
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 14).
b. VDD = - 25 V, starting TJ = 25 °C, L = 9.7 mH, Rg = 25 , peak IL = - 5.3 A.
c. ISD - 5.3 A, dI/dt - 80 A/μs, VDD 40 V, TJ 150 °C, suggested Rg = 24 .
d. 0.063" (1.6 mm) from case.
S13-0167-Rev. D, 04-Feb-13
Document Number: 91378
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000