PD - 95950
AUTOMOTIVE MOSFET
IRFR48ZPbF
IRFU48ZPbF
Features
HEXFET® Power MOSFET
l
Advanced Process Technology
D
l
l
l
UltraLowOn-Resistance
175°COperatingTemperature
Fast Switching
VDSS = 55V
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l
Repetitive Avalanche Allowed up to Tjmax
Lead-Free
RDS(on) = 11mΩ
G
Description
ID = 42A
Specifically designed for Automotive applications,
this HEXFET® Power MOSFET utilizes the latest
processing techniques to achieve extremely low
on-resistance per silicon area. Additional features
of this design are a 175°C junction operating
temperature, fast switching speed and improved
repetitive avalanche rating . These features com-
bine to make this design an extremely efficient and
reliable device for use in Automotive applications
and a wide variety of other applications.
S
D-Pak
I-Pak
IRFU48Z
IRFR48Z
Absolute Maximum Ratings
Parameter
Max.
Units
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V (Package Limited)
Pulsed Drain Current
I
I
I
I
@ T = 25°C
62
D
D
D
C
@ T = 100°C
44
42
A
C
@ T = 25°C
C
250
91
DM
P
@T = 25°C Power Dissipation
W
D
C
Linear Derating Factor
Gate-to-Source Voltage
0.61
± 20
W/°C
V
V
GS
Single Pulse Avalanche Energy
Single Pulse Avalanche Energy Tested Value
Avalanche Current
EAS (Thermally limited)
74
mJ
EAS (Tested )
110
IAR
See Fig.12a, 12b, 15, 16
A
Repetitive Avalanche Energy
Operating Junction and
EAR
mJ
T
T
-55 to + 175
J
Storage Temperature Range
°C
STG
Soldering Temperature, for 10 seconds
Mounting Torque, 6-32 or M3 screw
300 (1.6mm from case )
10 lbf in (1.1N m)
Thermal Resistance
Parameter
Typ.
–––
Max.
1.64
40
Units
Junction-to-Case
RθJC
RθJA
Junction-to-Ambient (PCB mount)
Junction-to-Ambient
–––
°C/W
Rθ
–––
110
JA
HEXFET® isaregisteredtrademarkofInternationalRectifier.
www.irf.com
1
12/20/04