5秒后页面跳转
IRFU1205 PDF预览

IRFU1205

更新时间: 2024-02-12 18:32:55
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
10页 146K
描述
Power MOSFET(Vdss=55V, Rds(on)=0.027ohm, Id=44A)

IRFU1205 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TO-251AA
包装说明:IN-LINE, R-PSIP-T3针数:3
Reach Compliance Code:not_compliantECCN代码:EAR99
风险等级:5.19其他特性:AVALANCHE RATED, ULTRA LOW RESISTANCE
雪崩能效等级(Eas):210 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:55 V
最大漏极电流 (Abs) (ID):37 A最大漏极电流 (ID):20 A
最大漏源导通电阻:0.027 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-251AAJESD-30 代码:R-PSIP-T3
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):69 W
最大脉冲漏极电流 (IDM):160 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFU1205 数据手册

 浏览型号IRFU1205的Datasheet PDF文件第2页浏览型号IRFU1205的Datasheet PDF文件第3页浏览型号IRFU1205的Datasheet PDF文件第4页浏览型号IRFU1205的Datasheet PDF文件第5页浏览型号IRFU1205的Datasheet PDF文件第6页浏览型号IRFU1205的Datasheet PDF文件第7页 
PD - 91318B  
IRFR/U1205  
HEXFET® Power MOSFET  
l Ultra Low On-Resistance  
l Surface Mount (IRFR1205)  
l Straight Lead (IRFU1205)  
l Fast Switching  
D
VDSS = 55V  
RDS(on) = 0.027Ω  
l Fully Avalanche Rated  
G
Description  
ID = 44A  
S
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve the  
lowest possible on-resistance per silicon area. This  
benefit, combined with the fast switching speed and  
ruggedized device design that HEXFET Power  
MOSFETs are well known for, provides the designer  
with an extremely efficient device for use in a wide  
variety of applications.  
The D-PAK is designed for surface mounting using  
vapor phase, infrared, or wave soldering techniques.  
The straight lead version (IRFU series) is for through-  
hole mounting applications. Power dissipation levels  
up to 1.5 watts are possible in typical surface mount  
applications.  
D-PAK  
T O -252AA  
I-PAK  
TO -251AA  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current ‡  
44ꢀ  
31ꢀ  
160  
107  
0.71  
± 20  
210  
25  
A
PD @TC = 25°C  
Power Dissipation  
W
W/°C  
V
Linear Derating Factor  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy‚‡  
Avalanche Current‡  
mJ  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy‡  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
11  
mJ  
V/ns  
5.0  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
–––  
–––  
Max.  
1.4  
Units  
°C/W  
1
RθJC  
RθJA  
Junction-to-Ambient (PCB mount) **  
Junction-to-Ambient  
50  
RθJA  
110  
www.irf.com  
5/11/98  

与IRFU1205相关器件

型号 品牌 描述 获取价格 数据表
IRFU1205PBF KERSEMI ULTRA LOW ON-RESISTANCE

获取价格

IRFU1205PBF INFINEON HEXFET Power MOSFET

获取价格

IRFU120A FAIRCHILD Advanced Power MOSFET

获取价格

IRFU120N INFINEON HEXFET Power MOSFET

获取价格

IRFU120N KERSEMI Surface Mount (IRFR120N)

获取价格

IRFU120NPBF INFINEON Fast Switching

获取价格