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IRFU1018EPBF PDF预览

IRFU1018EPBF

更新时间: 2024-11-05 03:37:07
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
10页 367K
描述
HEXFET TM Power MOSFET

IRFU1018EPBF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:LEAD FREE, IPAK-3Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.79
雪崩能效等级(Eas):88 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (Abs) (ID):79 A最大漏极电流 (ID):56 A
最大漏源导通电阻:0.0084 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-251AAJESD-30 代码:R-PSIP-T3
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):110 W
最大脉冲漏极电流 (IDM):315 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON

IRFU1018EPBF 数据手册

 浏览型号IRFU1018EPBF的Datasheet PDF文件第2页浏览型号IRFU1018EPBF的Datasheet PDF文件第3页浏览型号IRFU1018EPBF的Datasheet PDF文件第4页浏览型号IRFU1018EPBF的Datasheet PDF文件第5页浏览型号IRFU1018EPBF的Datasheet PDF文件第6页浏览型号IRFU1018EPBF的Datasheet PDF文件第7页 
PD - 97129  
IRFR1018EPbF  
IRFU1018EPbF  
HEXFET® Power MOSFET  
Applications  
l High Efficiency Synchronous Rectification in  
SMPS  
D
S
VDSS  
RDS(on) typ.  
max.  
ID (Silicon Limited)  
ID (Package Limited)  
60V  
l Uninterruptible Power Supply  
l High Speed Power Switching  
l Hard Switched and High Frequency Circuits  
7.1m  
8.4m  
:
:
G
79A  
c
56A  
Benefits  
l Improved Gate, Avalanche and Dynamic  
dv/dt Ruggedness  
l Fully Characterized Capacitance and  
Avalanche SOA  
l Enhanced body diode dV/dt and dI/dt  
Capability  
D-Pak  
I-Pak  
IRFR1018EPbF IRFU1018EPbF  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Symbol  
ID @ TC = 25°C  
ID @ TC = 100°C  
ID @ TC = 25°C  
IDM  
Parameter  
Max.  
79c  
Units  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
56c  
Continuous Drain Current, VGS @ 10V (Wire Bond Limited)  
Pulsed Drain Current d  
56  
A
315  
PD @TC = 25°C  
110  
Maximum Power Dissipation  
Linear Derating Factor  
W
0.76  
W/°C  
V
VGS  
± 20  
Gate-to-Source Voltage  
21  
Peak Diode Recovery f  
dv/dt  
TJ  
V/ns  
°C  
-55 to + 175  
Operating Junction and  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
300  
Avalanche Characteristics  
Single Pulse Avalanche Energy e  
EAS (Thermally limited)  
88  
47  
11  
mJ  
A
Avalanche Current d  
IAR  
Repetitive Avalanche Energy g  
EAR  
mJ  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
1.32  
40  
Units  
RθJC  
RθJA  
RθJA  
Junction-to-Case k  
°C/W  
Junction-to-Ambient (PCB Mount) jk  
Junction-to-Ambient k  
110  
Notes  through ‰ are on page 2  
www.irf.com  
1
3/8/08  

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