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IRFS52N15DTRL PDF预览

IRFS52N15DTRL

更新时间: 2024-11-26 13:08:47
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
11页 136K
描述
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IRFS52N15DTRL 数据手册

 浏览型号IRFS52N15DTRL的Datasheet PDF文件第2页浏览型号IRFS52N15DTRL的Datasheet PDF文件第3页浏览型号IRFS52N15DTRL的Datasheet PDF文件第4页浏览型号IRFS52N15DTRL的Datasheet PDF文件第5页浏览型号IRFS52N15DTRL的Datasheet PDF文件第6页浏览型号IRFS52N15DTRL的Datasheet PDF文件第7页 
PD - 94357  
IRFB52N15D  
IRFS52N15D  
SMPS MOSFET  
IRFSL52N15D  
HEXFET® Power MOSFET  
Applications  
l High frequency DC-DC converters  
VDSS  
150V  
RDS(on) max  
ID  
60A  
0.032Ω  
Benefits  
l Low Gate-to-Drain Charge to Reduce  
Switching Losses  
l Fully Characterized Capacitance Including  
Effective COSS to Simplify Design, (See  
App. Note AN1001)  
l Fully Characterized Avalanche Voltage  
and Current  
D2Pak  
TO-262  
TO-220AB  
IRFB52N15D  
IRFS52N15D  
IRFSL52N15D  
Absolute Maximum Ratings  
Parameter  
Max.  
60  
Units  
A
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
43  
240  
PD @TA = 25°C  
PD @TC = 25°C  
Power Dissipation ‡  
3.8  
W
Power Dissipation  
320  
Linear Derating Factor  
2.1  
W/°C  
V
VGS  
dv/dt  
TJ  
Gate-to-Source Voltage  
± 30  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
5.5  
V/ns  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torqe, 6-32 or M3 screw†  
°C  
300 (1.6mm from case )  
10 lbfin (1.1Nm)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
Max.  
Units  
RθJC  
RθCS  
RθJA  
RθJA  
0.47  
–––  
62  
Case-to-Sink, Flat, Greased Surface †  
Junction-to-Ambient†  
0.50  
–––  
°C/W  
Junction-to-Ambient‡  
–––  
40  
Notes  through ‡ are on page 11  
www.irf.com  
1
12/12/01  

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