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IRFS4227 PDF预览

IRFS4227

更新时间: 2024-09-11 11:14:27
品牌 Logo 应用领域
英飞凌 - INFINEON 开关光电二极管
页数 文件大小 规格书
11页 366K
描述
200V 单个 N 通道 HEXFET Power MOSFET PDP 开关, 采用 D2-Pak 封装

IRFS4227 数据手册

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PD - 96131A  
IRFS4227PbF  
PDP SWITCH  
IRFSL4227PbF  
Features  
Key Parameters  
l
Advanced Process Technology  
VDS max  
200  
240  
22  
V
V
l
Key Parameters Optimized for PDP Sustain,  
Energy Recovery and Pass Switch Applications  
Low EPULSE Rating to Reduce Power  
Dissipation in PDP Sustain, Energy Recovery  
and Pass Switch Applications  
VDS (Avalanche) typ.  
RDS(ON) typ. @ 10V  
IRP max @ TC= 100°C  
TJ max  
l
m
130  
175  
A
°C  
l
l
Low QG for Fast Response  
High Repetitive Peak Current Capability for  
Reliable Operation  
D
D
D
l
Short Fall & Rise Times for Fast Switching  
l
175°C Operating Junction Temperature for  
Improved Ruggedness  
S
D
S
G
D
G
G
l
Repetitive Avalanche Capability for  
Robustness and Reliability  
D2Pak  
IRFS4227PbF  
TO-262  
IRFSL4227PbF  
S
G
D
S
Gate  
Drain  
Source  
Description  
This HEXFET® Power MOSFET is specifically designed for Sustain, Energy Recovery & Pass switch  
applications in Plasma Display Panels. This MOSFET utilizes the latest processing techniques to  
achievelowon-resistancepersiliconareaandlowEPULSE rating.AdditionalfeaturesofthisMOSFETare  
175°C operating junction temperature and high repetitive peak current capability. These features  
combine to make this MOSFET a highly efficient, robust and reliable device for PDP driving applications  
Absolute Maximum Ratings  
Max.  
±30  
Parameter  
Units  
V
VGS  
Gate-to-Source Voltage  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
62  
44  
A
260  
IRP @ TC = 100°C  
PD @TC = 25°C  
PD @TC = 100°C  
130  
Repetitive Peak Current  
330  
Power Dissipation  
W
190  
Power Dissipation  
2.2  
Linear Derating Factor  
W/°C  
TJ  
-40 to + 175  
Operating Junction and  
TSTG  
°C  
N
Storage Temperature Range  
Soldering Temperature for 10 seconds  
Mounting Torque, 6-32 or M3 Screw  
300  
10lbf in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
0.45*  
Units  
Junction-to-Case  
Rθ  
JC  
Junction-to-Ambient (PCB Mounted) D2Pak  
RθJA  
–––  
40  
* RθJC (end of life) for D2Pak and TO-262 = 0.65°C/W. This is the maximum measured value after 1000 temperature  
cycles from -55 to 150°C and is accounted for by the physical wearout of the die attach medium.  
Notes  through †are on page 8  
www.irf.com  
1
12/06/08  

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