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IRFS3306 PDF预览

IRFS3306

更新时间: 2024-10-03 11:13:27
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
13页 328K
描述
60V 单个 N 通道 HEXFET Power MOSFET, 采用 D2-Pak 封装

IRFS3306 数据手册

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IRFB3306PbF  
IRFS3306PbF  
IRFSL3306PbF  
HEXFET® Power MOSFET  
60V  
Applications  
l High Efficiency Synchronous Rectification in SMPS  
l Uninterruptible Power Supply  
l High Speed Power Switching  
D
VDSS  
RDS(on) typ.  
3.3m  
4.2m  
160A  
max.  
l Hard Switched and High Frequency Circuits  
G
ID  
(Silicon Limited)  
Benefits  
ID (Package Limited)  
120A  
S
S
l Improved Gate, Avalanche and Dynamic dV/dt  
Ruggedness  
D
l Fully Characterized Capacitance and Avalanche  
SOA  
l Enhanced body diode dV/dt and dI/dt Capability  
l Lead-Free  
D
D
S
D
S
D
D
G
G
G
l RoHSCompliant,Halogen-Free  
D2Pak  
TO-262  
TO-220AB  
IRFS3306PbF  
IRFSL3306PbF  
IRFB3306PbF  
G
D
S
Gate  
Drain  
Source  
Standard Pack  
Base Part Number  
Package Type  
Orderable Part Number  
Form  
Quantity  
IRFB3306PbF  
IRFSL3306PbF  
TO-220  
TO-262  
Tube  
50  
IRFB3306PbF  
Tube  
Tube  
50  
50  
IRFSL3306PbF  
IRFS3306PbF  
IRFS3306PbF  
D2Pak  
Tape and Reel Left  
Tape and Reel Right  
800  
800  
IRFS3306TRLPbF  
IRFS3306TRRPbF  
Absolute Maximum Ratings  
Symbol  
Parameter  
Max.  
160  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
ID @ TC = 25°C  
IDM  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Wire Bond Limited)  
Pulsed Drain Current  
110  
A
120  
620  
230  
PD @TC = 25°C  
Maximum Power Dissipation  
W
1.5  
Linear Derating Factor  
W/°C  
V
± 20  
VGS  
Gate-to-Source Voltage  
14  
Peak Diode Recovery  
dv/dt  
TJ  
V/ns  
-55 to + 175  
Operating Junction and  
TSTG  
Storage Temperature Range  
°C  
300  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
10lb in (1.1N m)  
Mounting torque, 6-32 or M3 screw  
Avalanche Characteristics  
Single Pulse Avalanche Energy  
EAS (Thermally limited)  
184  
mJ  
A
Avalanche Current  
IAR  
See Fig. 14, 15, 22a, 22b,  
Repetitive Avalanche Energy  
EAR  
mJ  
Thermal Resistance  
Symbol  
Parameter  
Junction-to-Case  
Typ.  
Max.  
0.65  
–––  
62  
Units  
Rθ  
–––  
0.50  
–––  
–––  
JC  
Rθ  
Case-to-Sink, Flat Greased Surface , TO-220  
Junction-to-Ambient, TO-220  
Junction-to-Ambient (PCB Mount) , D2Pak  
CS  
°C/W  
Rθ  
JA  
Rθ  
JA  
40  
1
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Submit Datasheet Feedback  
April 24, 2014  

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