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IRFS3004-7P PDF预览

IRFS3004-7P

更新时间: 2024-11-25 14:55:03
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
10页 495K
描述
40V 单个 N 通道 HEXFET Power MOSFET, 采用 7引脚 D2-Pak 封装

IRFS3004-7P 数据手册

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PD - 97378A  
IRFS3004-7PPbF  
HEXFET® Power MOSFET  
Applications  
l High Efficiency Synchronous Rectification in SMPS  
D
VDSS  
RDS(on) typ.  
40V  
0.90m  
1.25m  
l Uninterruptible Power Supply  
l High Speed Power Switching  
l Hard Switched and High Frequency Circuits  
max.  
G
ID  
ID  
400A  
(Silicon Limited)  
Benefits  
240A  
S
(Package Limited)  
l Improved Gate, Avalanche and Dynamic dV/dt  
Ruggedness  
l Fully Characterized Capacitance and Avalanche  
D
SOA  
l Enhanced body diode dV/dt and dI/dt Capability  
l Lead-Free  
S
S
S
S
S
G
D2Pak 7 Pin  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Symbol  
ID @ TC = 25°C  
ID @ TC = 100°C  
ID @ TC = 25°C  
IDM  
Parameter  
Max.  
400  
Units  
A
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
280  
Continuous Drain Current, VGS @ 10V (Wire Bond Limited)  
Pulsed Drain Current  
240  
1610  
380  
PD @TC = 25°C  
W
Maximum Power Dissipation  
2.5  
Linear Derating Factor  
W/°C  
V
VGS  
± 20  
Gate-to-Source Voltage  
2.0  
Peak Diode Recovery  
dv/dt  
TJ  
V/ns  
-55 to + 175  
Operating Junction and  
TSTG  
°C  
Storage Temperature Range  
300  
Soldering Temperature, for 10 seconds (1.6mm from case)  
Avalanche Characteristics  
Single Pulse Avalanche Energy  
EAS (Thermally limited)  
290  
mJ  
A
Avalanche Current  
IAR  
See Fig. 14, 15, 22a, 22b  
Repetitive Avalanche Energy  
EAR  
mJ  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
–––  
Max.  
0.40  
40  
Units  
°C/W  
Rθ  
JC  
Junction-to-Case  
Rθ  
JA  
–––  
Junction-to-Ambient (PCB Mount)  
www.irf.com  
1
04/22/2010  

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