IRFR9010, IRFU9010, SiHFR9010, SiHFU9010
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
S
• Dynamic dV/dt rating
DPAK
(TO-252)
IPAK
(TO-251)
• Repetitive avalanche ratings
• Surface-mount (IRFR9010, SiHFR9010)
• Straight lead (IRFU9010, SiHFU9010)
• Simple drive requirements
G
D
D
Available
• Ease of paralleling
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
S
G
S
D
G
D
DESCRIPTION
P-Channel MOSFET
The power MOSFET technology is the key to Vishay’s
advanced line of power MOSFET transistors. The efficient
geometry and unique processing of this latest “State of the
PRODUCT SUMMARY
VDS (V)
Art” design achieves: very low on-state resistance
-50
combined with high transconductance; superior reverse
energy and diode recovery dV/dt capability.
RDS(on) (Ω)
VGS = -10 V
0.50
The power MOSFET transistors also feature all of the well
established advantages of MOSFETs such as voltage
control, very fast switching, ease of paralleling and
temperature stability of the electrical parameters.
Qg (Max.) (nC)
9.1
3.0
5.9
Qgs (nC)
gd (nC)
Q
Surface mount packages enhance circuit performance by
reducing stray inductances and capacitance. The DPAK
(TO-252) surface-mount package brings the advantages of
power MOSFETs to high volume applications where PC
Board surface mounting is desirable. The surface mount
option IRFR9010, SiHFR9010 is provided on 16 mm tape.
The straight lead option IRFU9010, SiHFU9010 of the device
is called the IPAK (TO-251).
Configuration
Single
They are well suited for applications where limited heat
dissipation is required such as, computers and peripherals,
telecommunication equipment, DC/DC converters, and a
wide range of consumer products.
ORDERING INFORMATION
Package
DPAK (TO-252)
SiHFR9010-GE3
IRFR9010PbF
DPAK (TO-252)
SiHFR9010TR-GE3 a
IRFR9010TRPbF a
DPAK (TO-252)
SiHFR9010TRL-GE3 a
IRFR9010TRLPbF a
IPAK (TO-251)
SiHFU9010-GE3
IRFU9010PbF
Lead (Pb)-free and halogen-free
Lead (Pb)-free
Note
a. See device orientation
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
-50
UNIT
Drain-source voltage
Gate-source voltage
VDS
V
VGS
20
TC = 25 °C
C = 100 °C
-5.3
Continuous drain current
VGS at -10 V
ID
T
-3.3
A
Pulsed drain current a
IDM
-21
Linear derating factor
Single pulse avalanche energy b
0.20
136
W/°C
mJ
A
EAS
IAR
Drain-source voltage
-5.3
Maximum power dissipation
Maximum power dissipation (PCB mount) e
Peak diode recovery dV/dt c
TC = 25 °C
EAR
2.5
mJ
W
TA = 25 °C
PD
25
dV/dt
TJ, Tstg
5.8
V/ns
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d
-55 to +150
300
°C
For 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 14)
b. VDD = - 25 V, starting TJ = 25 °C, L = 9.7 mH, Rg = 25 Ω, peak IL = - 5.3 A
c. ISD ≤ - 5.3 A, dI/dt ≤ - 80 A/μs, VDD ≤ 40 V, TJ ≤ 150 °C, suggested Rg = 24 Ω
d. 0.063" (1.6 mm) from case
S21-0373-Rev. E, 19-Apr-2021
Document Number: 91378
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000