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IRFR9010, IRFU9010, SiHFR9010, SiHFU9010 PDF预览

IRFR9010, IRFU9010, SiHFR9010, SiHFU9010

更新时间: 2024-10-03 14:50:27
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
13页 1530K
描述
Power MOSFET

IRFR9010, IRFU9010, SiHFR9010, SiHFU9010 数据手册

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IRFR9010, IRFU9010, SiHFR9010, SiHFU9010  
www.vishay.com  
Vishay Siliconix  
Power MOSFET  
FEATURES  
S
• Dynamic dV/dt rating  
DPAK  
(TO-252)  
IPAK  
(TO-251)  
• Repetitive avalanche ratings  
• Surface-mount (IRFR9010, SiHFR9010)  
• Straight lead (IRFU9010, SiHFU9010)  
• Simple drive requirements  
G
D
D
Available  
• Ease of paralleling  
• Material categorization: for definitions of  
compliance please see www.vishay.com/doc?99912  
S
G
S
D
G
D
DESCRIPTION  
P-Channel MOSFET  
The power MOSFET technology is the key to Vishay’s  
advanced line of power MOSFET transistors. The efficient  
geometry and unique processing of this latest “State of the  
PRODUCT SUMMARY  
VDS (V)  
Art” design achieves: very low on-state resistance  
-50  
combined with high transconductance; superior reverse  
energy and diode recovery dV/dt capability.  
RDS(on) (Ω)  
VGS = -10 V  
0.50  
The power MOSFET transistors also feature all of the well  
established advantages of MOSFETs such as voltage  
control, very fast switching, ease of paralleling and  
temperature stability of the electrical parameters.  
Qg (Max.) (nC)  
9.1  
3.0  
5.9  
Qgs (nC)  
gd (nC)  
Q
Surface mount packages enhance circuit performance by  
reducing stray inductances and capacitance. The DPAK  
(TO-252) surface-mount package brings the advantages of  
power MOSFETs to high volume applications where PC  
Board surface mounting is desirable. The surface mount  
option IRFR9010, SiHFR9010 is provided on 16 mm tape.  
The straight lead option IRFU9010, SiHFU9010 of the device  
is called the IPAK (TO-251).  
Configuration  
Single  
They are well suited for applications where limited heat  
dissipation is required such as, computers and peripherals,  
telecommunication equipment, DC/DC converters, and a  
wide range of consumer products.  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
SiHFR9010-GE3  
IRFR9010PbF  
DPAK (TO-252)  
SiHFR9010TR-GE3 a  
IRFR9010TRPbF a  
DPAK (TO-252)  
SiHFR9010TRL-GE3 a  
IRFR9010TRLPbF a  
IPAK (TO-251)  
SiHFU9010-GE3  
IRFU9010PbF  
Lead (Pb)-free and halogen-free  
Lead (Pb)-free  
Note  
a. See device orientation  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
-50  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
V
VGS  
20  
TC = 25 °C  
C = 100 °C  
-5.3  
Continuous drain current  
VGS at -10 V  
ID  
T
-3.3  
A
Pulsed drain current a  
IDM  
-21  
Linear derating factor  
Single pulse avalanche energy b  
0.20  
136  
W/°C  
mJ  
A
EAS  
IAR  
Drain-source voltage  
-5.3  
Maximum power dissipation  
Maximum power dissipation (PCB mount) e  
Peak diode recovery dV/dt c  
TC = 25 °C  
EAR  
2.5  
mJ  
W
TA = 25 °C  
PD  
25  
dV/dt  
TJ, Tstg  
5.8  
V/ns  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d  
-55 to +150  
300  
°C  
For 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 14)  
b. VDD = - 25 V, starting TJ = 25 °C, L = 9.7 mH, Rg = 25 Ω, peak IL = - 5.3 A  
c. ISD - 5.3 A, dI/dt - 80 A/μs, VDD 40 V, TJ 150 °C, suggested Rg = 24 Ω  
d. 0.063" (1.6 mm) from case  
S21-0373-Rev. E, 19-Apr-2021  
Document Number: 91378  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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