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IRFR48ZTRRPBF PDF预览

IRFR48ZTRRPBF

更新时间: 2024-11-27 14:51:35
品牌 Logo 应用领域
英飞凌 - INFINEON 局域网开关脉冲晶体管
页数 文件大小 规格书
11页 348K
描述
Power Field-Effect Transistor, 42A I(D), 55V, 0.011ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA, LEAD FREE, PLASTIC, DPAK-3

IRFR48ZTRRPBF 技术参数

是否Rohs认证:符合生命周期:Active
包装说明:LEAD FREE, PLASTIC, DPAK-3Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.12
Is Samacsys:N其他特性:AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE
雪崩能效等级(Eas):74 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:55 V
最大漏极电流 (Abs) (ID):42 A最大漏极电流 (ID):42 A
最大漏源导通电阻:0.011 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-252AAJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):91 W
最大脉冲漏极电流 (IDM):250 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:MATTE TIN OVER NICKEL端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFR48ZTRRPBF 数据手册

 浏览型号IRFR48ZTRRPBF的Datasheet PDF文件第2页浏览型号IRFR48ZTRRPBF的Datasheet PDF文件第3页浏览型号IRFR48ZTRRPBF的Datasheet PDF文件第4页浏览型号IRFR48ZTRRPBF的Datasheet PDF文件第5页浏览型号IRFR48ZTRRPBF的Datasheet PDF文件第6页浏览型号IRFR48ZTRRPBF的Datasheet PDF文件第7页 
PD - 95950A  
IRFR48ZPbF  
IRFU48ZPbF  
Features  
Advanced Process Technology  
HEXFET® Power MOSFET  
UltraLowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
D
VDSS = 55V  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free  
RDS(on) = 11mΩ  
G
Description  
ID = 42A  
S
ThisHEXFET® PowerMOSFETutilizesthelatest  
processing techniques to achieve extremely low  
on-resistancepersiliconarea.Additionalfeatures  
of this design are a 175°C junction operating  
temperature, fast switching speed and improved  
repetitiveavalancherating.Thesefeaturescombine  
to make this design an extremely efficient and  
reliable device for use in a wide variety of  
applications.  
I-Pak  
IRFU48ZPbF  
D-Pak  
IRFR48ZPbF  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
I
I
I
I
@ T = 25°C  
C
62  
D
D
D
Continuous Drain Current, VGS @ 10V  
@ T = 100°C  
C
44  
42  
A
(Package Limited)  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
@ T = 25°C  
C
250  
91  
DM  
P
@T = 25°C Power Dissipation  
W
D
C
Linear Derating Factor  
0.61  
± 20  
W/°C  
V
V
Gate-to-Source Voltage  
Single Pulse Avalanche Energy  
GS  
EAS (Thermally limited)  
74  
mJ  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
E
AS (Tested )  
110  
IAR  
See Fig.12a, 12b, 15, 16  
A
Repetitive Avalanche Energy  
Operating Junction and  
EAR  
mJ  
T
J
-55 to + 175  
T
Storage Temperature Range  
°C  
STG  
Soldering Temperature, for 10 seconds  
Mounting Torque, 6-32 or M3 screw  
300 (1.6mm from case )  
10 lbf in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
1.64  
40  
Units  
Junction-to-Case  
Rθ  
Rθ  
Rθ  
JC  
JA  
JA  
Junction-to-Ambient (PCB mount)  
Junction-to-Ambient  
–––  
°C/W  
–––  
110  
HEXFET® isaregisteredtrademarkofInternationalRectifier.  
www.irf.com  
1
09/27/10  

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