November 2001
IRFR330B / IRFU330B
400V N-Channel MOSFET
General Description
Features
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for high efficiency switch mode power supplies and
electronic lamp ballasts based on half bridge.
•
•
•
•
•
•
4.5A, 400V, R
= 1.0Ω @V = 10 V
DS(on) GS
Low gate charge ( typical 25 nC)
Low Crss ( typical 20 pF)
Fast switching
100% avalanche tested
Improved dv/dt capability
D
!
D
●
◀
▲
●
●
G!
I-PAK
IRFU Series
D-PAK
IRFR Series
G
S
G D S
!
S
Absolute Maximum Ratings
T = 25°C unless otherwise noted
C
Symbol
Parameter
IRFR330B / IRFU330B
Units
V
V
I
Drain-Source Voltage
400
4.5
DSS
- Continuous (T = 25°C)
Drain Current
A
D
C
- Continuous (T = 100°C)
2.9
A
C
I
(Note 1)
Drain Current
- Pulsed
18
A
DM
V
E
I
Gate-Source Voltage
± 30
330
V
GSS
AS
(Note 2)
(Note 1)
(Note 1)
(Note 3)
Single Pulsed Avalanche Energy
Avalanche Current
mJ
A
4.5
AR
E
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
4.8
mJ
V/ns
W
AR
dv/dt
5.5
Power Dissipation (T = 25°C) *
2.5
P
A
D
Power Dissipation (T = 25°C)
48
W
C
- Derate above 25°C
Operating and Storage Temperature Range
0.38
-55 to +150
W/°C
°C
T , T
J
stg
Maximum lead temperature for soldering purposes,
T
300
°C
L
1/8" from case for 5 seconds
Thermal Characteristics
Symbol
Parameter
Typ
--
Max
2.6
50
Units
°C/W
°C/W
°C/W
R
R
R
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient *
Thermal Resistance, Junction-to-Ambient
θJC
θJA
θJA
--
--
110
* When mounted on the minimum pad size recommended (PCB Mount)
©2001 Fairchild Semiconductor Corporation
Rev. B, November 2001