Datasheet > IRFR310TRL

IRFR310TRL

更新时间： 2024-02-10 23:26:27

品牌	Logo	应用领域
科盛美 - KERSEMI		晶体晶体管开关脉冲
页数	文件大小	规格书
7页	3932K
描述
Power MOSFET

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中文翻译

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数据手册

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IRFR310TRL 数据手册

IRFR310, IRFU310, SiHFR310, SiHFU310

Power MOSFET

FEATURES

• Dynamic dV/dt Rating

PRODUCT SUMMARY

V_DS(V)

400

Available

• Repetitive Avalanche Rated

3.6

R_DS(on)(Ω)

V_GS= 10 V

RoHS*

• Surface Mount (IRFR310/SiHFR310)

COMPLIANT

Q_g(Max.) (nC)

1.9

6.5

• Straight Lead (IRFU310/SiHFU310)

• Available in Tape and Reel

• Fast Switching

_gs(nC)

Q_gd(nC)

Configuration

Single

• Fully Avalanche Rated

• Lead (Pb)-free Available

DPAK

IPAK

(TO-252)

(TO-251)

DESCRIPTION

Third generation Power MOSFETs form Vishay provide the

designer with the best combination of fast switching,

ruggedized device design, low on-resistance and

cost-effectiveness.

The DPAK is designed for surface mounting using vapor

phase, infrared, or wave soldering techniques. The straight

lead version (IRFU/SiHFU series) is for through-hole

mounting applications. Power dissipation levels up to 1.5 W

are possible in typical surface mount applications.

N-Channel MOSFET

ORDERING INFORMATION

Package

DPAK (TO-252)

IRFR310PbF

SiHFR310-E3

IRFR310

DPAK (TO-252)

IRFR310TRPbF^a

SiHFR310T-E3^a

IRFR310TR^a

DPAK (TO-252)

IRFR310TRRPbF^a

SiHFR310TR-E3^a

IPAK (TO-251)

IRFU310PbF

SiHFU310-E3

IRFU310

IRFR310TRLPbF^a

SiHFR310TL-E3^a

IRFR310TRL^a

Lead (Pb)-free

SnPb

SiHFR310

SiHFR310TL^a

SiHFR310T^a

SiHFU310

Note

a. See device orientation.

ABSOLUTE MAXIMUM RATINGS T_C= 25 °C, unless otherwise noted

PARAMETER

SYMBOL

LIMIT

400

UNIT

Drain-Source Voltage

Gate-Source Voltage

V_DS

V_GS

T_C= 25 °C

1.7

Continuous Drain Current

V_GSat 10 V

I_D

T_C= 100 °C

1.1

Pulsed Drain Current^a

I_DM

6.0

Linear Derating Factor

0.20

0.020

W/°C

Linear Derating Factor (PCB Mount)^e

Single Pulse Avalanche Energy^b

Repetitive Avalanche Current^a

E_AS

I_AR

1.7

Repetitive Avalanche Energy^a

E_AR

2.5

Maximum Power Dissipation

Maximum Power Dissipation (PCB Mount)^e

Peak Diode Recovery dV/dt^c

T_C= 25 °C

P_D

V/ns

°C

T_A= 25 °C

2.5

dV/dt

4.0

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature)

T_J, T_stg

- 55 to + 150

260^d

for 10 s

www.kersemi.com

12 3 4 5 6 7

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