IRFR310, IRFU310, SiHFR310, SiHFU310
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
D
• Dynamic dV/dt rating
DPAK
(TO-252)
IPAK
(TO-251)
• Repetitive avalanche rated
• Surface-mount (IRFR310, SiHFR310)
• Straight lead (IRFU310, SiHFU310)
• Available in tape and reel
D
D
G
Available
• Fast switching
• Fully avalanche rated
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
S
G
S
D
G
S
N-Channel MOSFET
DESCRIPTION
Third generation power MOSFETs form Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
PRODUCT SUMMARY
VDS (V)
400
RDS(on) ()
VGS = 10 V
3.6
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU, SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface-mount applications.
Qg max. (nC)
12
1.9
Q
gs (nC)
gd (nC)
Q
6.5
Configuration
Single
ORDERING INFORMATION
Package
DPAK (TO-252)
DPAK (TO-252)
SiHFR310TRL-GE3 a
IRFR310TRLPbF-BE3 a, b IRFR310TRPbF-BE3 a, b
IRFR310TRLPbF a IRFR310TRPbF a
DPAK (TO-252)
SiHFR310TR-GE3 a
IPAK (TO-251)
SiHFU310-GE3
-
SiHFR310-GE3
Lead (Pb)-free and halogen-free
Lead (Pb)-free
SiHFR310TRR-GE3 a
IRFR310PbF
IRFU310PbF
Notes
a. See device orientation
b. “-BE3” denotes alternate manufacturing location
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
400
UNIT
Drain-source voltage
Gate-source voltage
VDS
V
VGS
20
T
C = 25 °C
1.7
Continuous drain current
VGS at 10 V
ID
TC = 100 °C
1.1
A
Pulsed drain current a
IDM
6.0
Linear derating factor
0.20
0.020
86
W/°C
Linear derating factor (PCB mount) e
Single pulse avalanche energy b
Repetitive avalanche current a
EAS
IAR
mJ
A
1.7
Repetitive avalanche energy a
EAR
2.5
mJ
Maximum power dissipation
T
C = 25 °C
25
PD
W
V/ns
°C
Maximum power dissipation (PCB mount) e
Peak diode recovery dV/dt c
TA = 25 °C
2.5
dV/dt
4.0
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d
TJ, Tstg
-55 to +150
260
For 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. VDD = 50 V, starting TJ = 25 °C, L = 52 mH, Rg = 25 , IAS = 1.7 A (see fig. 12)
c. ISD 1.7 A, dI/dt 40 A/μs, VDD VDS, TJ 150 °C
d. 1.6 mm from case
e. When mounted on 1” square PCB (FR-4 or G-10 material)
S23-0902-Rev. F, 30-Oct-2023
Document Number: 91272
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000