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IRFR310, IRFU310, SiHFR310, SiHFU310 PDF预览

IRFR310, IRFU310, SiHFR310, SiHFU310

更新时间: 2023-12-06 20:10:29
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威世 - VISHAY /
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13页 830K
描述
Power MOSFET

IRFR310, IRFU310, SiHFR310, SiHFU310 数据手册

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IRFR310, IRFU310, SiHFR310, SiHFU310  
www.vishay.com  
Vishay Siliconix  
Power MOSFET  
FEATURES  
D
• Dynamic dV/dt rating  
DPAK  
(TO-252)  
IPAK  
(TO-251)  
• Repetitive avalanche rated  
• Surface-mount (IRFR310, SiHFR310)  
• Straight lead (IRFU310, SiHFU310)  
• Available in tape and reel  
D
D
G
Available  
• Fast switching  
• Fully avalanche rated  
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
S
G
S
D
G
S
N-Channel MOSFET  
DESCRIPTION  
Third generation power MOSFETs form Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
PRODUCT SUMMARY  
VDS (V)  
400  
RDS(on) ()  
VGS = 10 V  
3.6  
The DPAK is designed for surface mounting using vapor  
phase, infrared, or wave soldering techniques. The straight  
lead version (IRFU, SiHFU series) is for through-hole  
mounting applications. Power dissipation levels up to 1.5 W  
are possible in typical surface-mount applications.  
Qg max. (nC)  
12  
1.9  
Q
gs (nC)  
gd (nC)  
Q
6.5  
Configuration  
Single  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
DPAK (TO-252)  
SiHFR310TRL-GE3 a  
IRFR310TRLPbF-BE3 a, b IRFR310TRPbF-BE3 a, b  
IRFR310TRLPbF a IRFR310TRPbF a  
DPAK (TO-252)  
SiHFR310TR-GE3 a  
IPAK (TO-251)  
SiHFU310-GE3  
-
SiHFR310-GE3  
Lead (Pb)-free and halogen-free  
Lead (Pb)-free  
SiHFR310TRR-GE3 a  
IRFR310PbF  
IRFU310PbF  
Notes  
a. See device orientation  
b. “-BE3” denotes alternate manufacturing location  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
400  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
V
VGS  
20  
T
C = 25 °C  
1.7  
Continuous drain current  
VGS at 10 V  
ID  
TC = 100 °C  
1.1  
A
Pulsed drain current a  
IDM  
6.0  
Linear derating factor  
0.20  
0.020  
86  
W/°C  
Linear derating factor (PCB mount) e  
Single pulse avalanche energy b  
Repetitive avalanche current a  
EAS  
IAR  
mJ  
A
1.7  
Repetitive avalanche energy a  
EAR  
2.5  
mJ  
Maximum power dissipation  
T
C = 25 °C  
25  
PD  
W
V/ns  
°C  
Maximum power dissipation (PCB mount) e  
Peak diode recovery dV/dt c  
TA = 25 °C  
2.5  
dV/dt  
4.0  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d  
TJ, Tstg  
-55 to +150  
260  
For 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)  
b. VDD = 50 V, starting TJ = 25 °C, L = 52 mH, Rg = 25 , IAS = 1.7 A (see fig. 12)  
c. ISD 1.7 A, dI/dt 40 A/μs, VDD VDS, TJ 150 °C  
d. 1.6 mm from case  
e. When mounted on 1” square PCB (FR-4 or G-10 material)  
S23-0902-Rev. F, 30-Oct-2023  
Document Number: 91272  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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