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IRFR2905ZPBF PDF预览

IRFR2905ZPBF

更新时间: 2024-11-26 04:18:47
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
12页 274K
描述
HEXFET㈢ Power MOSFET ( VDSS = 55V , RDS(on) = 14.5mヘ , ID = 42A )

IRFR2905ZPBF 技术参数

是否Rohs认证:符合生命周期:Obsolete
包装说明:LEAD FREE, PLASTIC, DPAK-3Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.09
Is Samacsys:N其他特性:AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE
雪崩能效等级(Eas):82 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:55 V
最大漏极电流 (Abs) (ID):59 A最大漏极电流 (ID):42 A
最大漏源导通电阻:0.0145 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-252AAJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):110 W
最大脉冲漏极电流 (IDM):240 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFR2905ZPBF 数据手册

 浏览型号IRFR2905ZPBF的Datasheet PDF文件第2页浏览型号IRFR2905ZPBF的Datasheet PDF文件第3页浏览型号IRFR2905ZPBF的Datasheet PDF文件第4页浏览型号IRFR2905ZPBF的Datasheet PDF文件第5页浏览型号IRFR2905ZPBF的Datasheet PDF文件第6页浏览型号IRFR2905ZPBF的Datasheet PDF文件第7页 
PD - 95943A  
IRFR2905ZPbF  
AUTOMOTIVE MOSFET  
IRFU2905ZPbF  
HEXFET® Power MOSFET  
Features  
D
l
l
l
l
l
Advanced Process Technology  
VDSS = 55V  
Ultra Low On-Resistance  
175°C Operating Temperature  
Fast Switching  
RDS(on) = 14.5mΩ  
G
Repetitive Avalanche Allowed up to Tjmax  
l
Lead-Free  
ID = 42A  
S
Description  
Specifically designed for Automotive applications, this HEXFET®  
Power MOSFET utilizes the latest processing techniques to  
achieve extremely low on-resistance per silicon area. Additional  
features of this design are a 175°C junction operating tempera-  
ture, fast switching speed and improved repetitive avalanche  
rating . These features combine to make this design an extremely  
efficientandreliabledeviceforuseinAutomotiveapplicationsand  
a wide variety of other applications.  
D-Pak  
IRFR2905Z  
I-Pak  
IRFU2905Z  
Absolute Maximum Ratings  
Parameter  
Max.  
59  
Units  
(Silicon Limited)  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
I
I
I
I
@ T = 25°C  
C
D
D
D
@ T = 100°C  
C
42  
A
(Package Limited)  
@ T = 25°C  
C
42  
240  
110  
DM  
P
@T = 25°C  
Power Dissipation  
C
W
D
Linear Derating Factor  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy  
0.72  
± 20  
W/°C  
V
V
GS  
EAS (Thermally limited)  
55  
mJ  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
EAS (Tested )  
82  
IAR  
See Fig.12a, 12b, 15, 16  
A
Repetitive Avalanche Energy  
EAR  
mJ  
T
J
Operating Junction and  
-55 to + 175  
T
Storage Temperature Range  
°C  
STG  
Soldering Temperature, for 10 seconds  
Mounting Torque, 6-32 or M3 screw  
300 (1.6mm from case )  
10 lbf in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
1.38  
40  
Units  
Junction-to-Case  
Rθ  
Rθ  
Rθ  
JC  
JA  
JA  
Junction-to-Ambient (PCB mount)  
Junction-to-Ambient  
°C/W  
110  
HEXFET® is a registered trademark of International Rectifier.  
www.irf.com  
1
12/14/04  

IRFR2905ZPBF 替代型号

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IRFR2905ZTRPBF INFINEON

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