AUIRFR2607Z
Features
V(BR)DSS
75V
D
S
l
l
l
l
l
l
l
AdvancedProcessTechnology
RDS(on) typ.
max.
UltraLowOn-Resistance
175°COperatingTemperature
FastSwitching
17.6m
Ω
22m
45A
Ω
G
RepetitiveAvalancheAlloweduptoTjmax
Lead-Free,RoHSCompliant
AutomotiveQualified*
ID (Silicon Limited)
ID (Package Limited)
42A
Description
D
Specifically designed for Automotive applications, this
HEXFET® Power MOSFET utilizes the latest processing
techniques to achieve extremely low on-resistance per
siliconarea. Additionalfeaturesofthisdesign area175°C
junction operating temperature, fast switching speed and
improved repetitive avalanche rating . These features
combine to make this design an extremely efficient and
reliabledeviceforuseinAutomotiveapplicationsandawide
varietyofotherapplications.
S
D
G
D-Pak
AUIRFR2607Z
G
D
S
Gate
Drain
Source
AbsoluteMaximumRatings
Stressesbeyondthoselistedunder“AbsoluteMaximumRatings”maycausepermanentdamagetothedevice. These
arestressratingsonly;andfunctionaloperationofthedeviceattheseoranyotherconditionbeyondthoseindicatedin
thespecificationsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevice
reliability.Thethermalresistanceandpowerdissipationratingsaremeasuredunderboardmountedandstillairconditions.
Ambienttemperature(TA)is25°C, unlessotherwisespecified.
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Silicon Limited)
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V (Silicon Limited)
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Package Limited)
45
32
A
42
IDM
180
Pulsed Drain Current
PD @TC = 25°C
110
Power Dissipation
W
W/°C
V
0.72
Linear Derating Factor
VGS
EAS
± 20
Gate-to-Source Voltage
96
Single Pulse Avalanche Energy (Thermally limited)
Single Pulse Avalanche Energy Tested Value
Avalanche Current
mJ
E
AS (Tested )
96
IAR
See Fig.12a, 12b, 15, 16
A
EAR
TJ
Repetitive Avalanche Energy
Operating Junction and
mJ
-55 to + 175
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting Torque, 6-32 or M3 screw
°C
300 (1.6mm from case )
10 lbf in (1.1N m)
Thermal Resistance
Parameter
Typ.
–––
–––
–––
Max.
1.38
50
Units
RθJC
RθJA
RθJA
Junction-to-Case
Junction-to-Ambient (PCB mount)
Junction-to-Ambient
°C/W
110
www.kersemi.com
1
08/24/10