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IRFR2607ZTRR PDF预览

IRFR2607ZTRR

更新时间: 2024-11-26 12:08:39
品牌 Logo 应用领域
科盛美 - KERSEMI 晶体晶体管开关脉冲局域网
页数 文件大小 规格书
11页 4073K
描述
Advanced Process Technology

IRFR2607ZTRR 数据手册

 浏览型号IRFR2607ZTRR的Datasheet PDF文件第2页浏览型号IRFR2607ZTRR的Datasheet PDF文件第3页浏览型号IRFR2607ZTRR的Datasheet PDF文件第4页浏览型号IRFR2607ZTRR的Datasheet PDF文件第5页浏览型号IRFR2607ZTRR的Datasheet PDF文件第6页浏览型号IRFR2607ZTRR的Datasheet PDF文件第7页 
AUIRFR2607Z  
Features  
V(BR)DSS  
75V  
D
S
l
l
l
l
l
l
l
AdvancedProcessTechnology  
RDS(on) typ.  
max.  
UltraLowOn-Resistance  
175°COperatingTemperature  
FastSwitching  
17.6m  
22m  
45A  
G
RepetitiveAvalancheAlloweduptoTjmax  
Lead-Free,RoHSCompliant  
AutomotiveQualified*  
ID (Silicon Limited)  
ID (Package Limited)  
42A  
Description  
D
Specifically designed for Automotive applications, this  
HEXFET® Power MOSFET utilizes the latest processing  
techniques to achieve extremely low on-resistance per  
siliconarea. Additionalfeaturesofthisdesign area175°C  
junction operating temperature, fast switching speed and  
improved repetitive avalanche rating . These features  
combine to make this design an extremely efficient and  
reliabledeviceforuseinAutomotiveapplicationsandawide  
varietyofotherapplications.  
S
D
G
D-Pak  
AUIRFR2607Z  
G
D
S
Gate  
Drain  
Source  
AbsoluteMaximumRatings  
StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice. These  
arestressratingsonly;andfunctionaloperationofthedeviceattheseoranyotherconditionbeyondthoseindicatedin  
thespecificationsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevice  
reliability.Thethermalresistanceandpowerdissipationratingsaremeasuredunderboardmountedandstillairconditions.  
Ambienttemperature(TA)is25°C, unlessotherwisespecified.  
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Silicon Limited)  
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V (Silicon Limited)  
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Package Limited)  
45  
32  
A
42  
IDM  
180  
Pulsed Drain Current  
PD @TC = 25°C  
110  
Power Dissipation  
W
W/°C  
V
0.72  
Linear Derating Factor  
VGS  
EAS  
± 20  
Gate-to-Source Voltage  
96  
Single Pulse Avalanche Energy (Thermally limited)  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
mJ  
E
AS (Tested )  
96  
IAR  
See Fig.12a, 12b, 15, 16  
A
EAR  
TJ  
Repetitive Avalanche Energy  
Operating Junction and  
mJ  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting Torque, 6-32 or M3 screw  
°C  
300 (1.6mm from case )  
10 lbf in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
1.38  
50  
Units  
RθJC  
RθJA  
RθJA  
Junction-to-Case  
Junction-to-Ambient (PCB mount)  
Junction-to-Ambient  
°C/W  
110  
www.kersemi.com  
1
08/24/10  

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