IRFR2605

更新时间： 2024-11-25 22:40:59

品牌	Logo	应用领域
英飞凌 - INFINEON		晶体晶体管功率场效应晶体管
页数	文件大小	规格书
8页	307K
描述
Power MOSFET(Vdss=55V, Rds(on)=0.075ohm, Id=19A)

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IRFR2605 数据手册

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PD - 9.1253

IRFR2605

IRFU2605

HEXFET^®Power MOSFET

Ultra Low On-Resistance

ESD Protected

Surface Mount (IRFR2605)

Straight Lead (IRFU2605)

150°C Operating Temperature

Repetitive Avalanche Rated

Fast Switching

V_DSS= 55V

R_DS(on)= 0.075Ω

I_D= 19A

Description

Fourth Generation HEXFETs from International Rectifier utilize advanced

processing techniques that achieve extremely low on-resistance per silicon area

and allow electrostatic discharge protection to be integrated in the gate structure.

These benefits, combined with the ruggedized device design that HEXFETs are

known for, provide the designer with extremely efficient and reliable device for use

in a wide variety of applications.

D-PAK

TO-252AA

I-PAK

TO-251AA

The D-PAK is designed for surface mounting using vapor phase, infrared, or wave

soldering techniques. The straight lead version (IRFU series) is for through-hole

mounting applications. Power dissipation levels up to 1.5 watts are possible in

typical surface mount applications.

Absolute Maximum Ratings

Parameter

Max.

Units

I_D@ T_C= 25°C

I_D@ T_C= 100°C

I_DM

Continuous Drain Current, V_GS@ 10V

Pulsed Drain Current

P_D@T_C= 25°C

Power Dissipation

Power Dissipation (PCB Mount)**

Linear Derating Factor

3.1

0.40

0.025

±20

100

W/°C

Linear Derating Factor (PCB Mount)**

Gate-to-Source Voltage

V_GS

E_AS

Single Pulse Avalanche Energy

Avalanche Current

I_AR

E_AR

Repetitive Avalanche Energy

Peak Diode Recovery dv/dt

5.0

4.5

V/ns

dv/dt

T_J,T_STG

Junction and Storage Temperature Range

Soldering Temperature, for 10 seconds

Human Body Model, 100pF, 1.5KΩ

-55 to + 150

300 (1.6mm from case)

2000

°C

V_ESD

Thermal Resistance

Parameter

Junction-to-Case

Min.

—

Typ.

—

Max.

2.5

Units

R_θJC

R_θJA

Junction-to-Ambient (PCB Mount)**

Junction-to-Ambient

—

°C/W

—

** When mounted on 1" square PCB (FR-4 or G-10 Material).

For recommended footprint and soldering techniques refer to application note #AN-994.

To Order

12 3 4 5 6 7 8

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与IRFR2605相关器件

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IRFR2607ZPBF	KERSEMI	获取价格	AUTOMOTIVE MOSFET
IRFR2607ZPBF_15	INFINEON	获取价格	Advanced Process Technology
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