IRFR224, IRFU224, SiHFR224, SiHFU224
Power MOSFET
FEATURES
• Dynamic dV/dt Rating
PRODUCT SUMMARY
VDS (V)
250
Available
• Repetitive Avalanche Rated
RDS(on) (Ω)
VGS = 10 V
1.1
RoHS*
• Surface Mount (IRFR224/SiHFR224)
• Straight Lead (IRFU224/SiHFU224)
• Available in Tape and Reel
• Fast Switching
COMPLIANT
Qg (Max.) (nC)
14
2.7
Q
gs (nC)
Qgd (nC)
7.8
Configuration
Single
• Ease of Paralleling
D
• Lead (Pb)-free Available
DPAK
(TO-252)
IPAK
(TO-251)
DESCRIPTION
Third generation Power MOSFETs form Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
G
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave solderig techniques. The straight
lead version (IRFU/SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.
S
N-Channel MOSFET
ORDERING INFORMATION
Package
DPAK (TO-252)
DPAK (TO-252)
DPAK (TO-252)
IRFR224TRLPbFa
SiHFR224TL-E3a
IRFR224TRLa
IPAK (TO-251)
IRFU224PbF
SiHFU224-E3
IRFU224
IRFR224PbF
SiHFR224-E3
IRFR224
IRFR224TRPbFa
SiHFR224T-E3a
IRFR224TRa
Lead (Pb)-free
SnPb
SiHFR224
SiHFR224Ta
SiHFR224TLa
SiHFU224
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
250
20
V
VGS
TC = 25 °C
3.8
Continuous Drain Current
VGS at 10 V
ID
TC = 100 °C
2.4
15
A
Pulsed Drain Currenta
IDM
Linear Derating Factor
0.33
0.020
130
3.8
W/°C
Linear Derating Factor (PCB Mount)e
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
Repetitive Avalanche Energya
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)e
Peak Diode Recovery dV/dtc
EAS
IAR
mJ
A
EAR
4.2
mJ
TC = 25 °C
TA = 25 °C
42
PD
W
2.5
dV/dt
4.8
V/ns
www.kersemi.com
1