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IRFR224TRA PDF预览

IRFR224TRA

更新时间: 2024-11-25 12:04:55
品牌 Logo 应用领域
科盛美 - KERSEMI /
页数 文件大小 规格书
7页 3373K
描述
Power MOSFET

IRFR224TRA 数据手册

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IRFR224, IRFU224, SiHFR224, SiHFU224  
Power MOSFET  
FEATURES  
• Dynamic dV/dt Rating  
PRODUCT SUMMARY  
VDS (V)  
250  
Available  
• Repetitive Avalanche Rated  
RDS(on) (Ω)  
VGS = 10 V  
1.1  
RoHS*  
• Surface Mount (IRFR224/SiHFR224)  
• Straight Lead (IRFU224/SiHFU224)  
• Available in Tape and Reel  
• Fast Switching  
COMPLIANT  
Qg (Max.) (nC)  
14  
2.7  
Q
gs (nC)  
Qgd (nC)  
7.8  
Configuration  
Single  
• Ease of Paralleling  
D
• Lead (Pb)-free Available  
DPAK  
(TO-252)  
IPAK  
(TO-251)  
DESCRIPTION  
Third generation Power MOSFETs form Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
G
The DPAK is designed for surface mounting using vapor  
phase, infrared, or wave solderig techniques. The straight  
lead version (IRFU/SiHFU series) is for through-hole  
mounting applications. Power dissipation levels up to 1.5 W  
are possible in typical surface mount applications.  
S
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
DPAK (TO-252)  
DPAK (TO-252)  
IRFR224TRLPbFa  
SiHFR224TL-E3a  
IRFR224TRLa  
IPAK (TO-251)  
IRFU224PbF  
SiHFU224-E3  
IRFU224  
IRFR224PbF  
SiHFR224-E3  
IRFR224  
IRFR224TRPbFa  
SiHFR224T-E3a  
IRFR224TRa  
Lead (Pb)-free  
SnPb  
SiHFR224  
SiHFR224Ta  
SiHFR224TLa  
SiHFU224  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
250  
20  
V
VGS  
TC = 25 °C  
3.8  
Continuous Drain Current  
VGS at 10 V  
ID  
TC = 100 °C  
2.4  
15  
A
Pulsed Drain Currenta  
IDM  
Linear Derating Factor  
0.33  
0.020  
130  
3.8  
W/°C  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
Repetitive Avalanche Energya  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
EAS  
IAR  
mJ  
A
EAR  
4.2  
mJ  
TC = 25 °C  
TA = 25 °C  
42  
PD  
W
2.5  
dV/dt  
4.8  
V/ns  
www.kersemi.com  
1

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