IRFR120, IRFU120, SiHFR120, SiHFU120
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
D
• Dynamic dV/dt rating
• Repetitive avalanche rated
• Surface-mount (IRFR120, SiHFR120)
• Straight lead (IRFU120, SiHFU120)
• Available in tape and reel
DPAK
(TO-252)
IPAK
(TO-251)
D
D
G
Available
• Fast switching
• Ease of paralleling
• Material categorization: for definitions of compliance
S
G
S
D
G
S
N-Channel MOSFET
please see www.vishay.com/doc?99912
DESCRIPTION
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU, SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.
PRODUCT SUMMARY
VDS (V)
100
RDS(on) (Ω)
VGS = 10 V
0.27
Qg max. (nC)
16
4.4
7.7
Q
gs (nC)
gd (nC)
Q
Configuration
Single
ORDERING INFORMATION
PACKAGE
DPAK (TO-252)
DPAK (TO-252)
DPAK (TO-252)
DPAK (TO-252)
IPAK (TO-251)
SiHFR120-GE3
SiHFR120TR-GE3 a
SiHFR120TRR-GE3 a
SiHFR120TRL-GE3 a
SiHFU120-GE3
Lead (Pb)-free
and halogen-free
IRFR120PbF-BE3
IRFR120TRPbF-BE3
IRFR120TRRPbF-BE3
IRFR120TRLPbF-BE3
-
b
ab
ab
ab
Lead (Pb)-free
IRFR120PbF
IRFR120TRPbF a
IRFR120TRRPbF a
IRFR120TRLPbF a
IRFU120PbF
Notes
a. See device orientation
b. “-BE3” denotes alternate manufacturing location
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
100
UNIT
Drain-source voltage
Gate-source voltage
VDS
V
VGS
20
TC = 25 °C
C = 100 °C
7.7
Continuous drain current
VGS at 10 V
ID
T
4.9
A
Pulsed drain current a
IDM
31
Linear derating factor
0.33
0.020
210
W/°C
Linear derating factor (PCB mount) e
Single pulse avalanche energy b
Repetitive avalanche Current a
EAS
IAR
mJ
A
7.7
Repetitive avalanche Energy a
EAR
4.2
mJ
Maximum power dissipation
Maximum power dissipation (PCB mount)e
Peak diode recovery dV/dt c
T
C = 25 °C
42
PD
W
V/ns
°C
TA = 25 °C
2.5
dV/dt
5.5
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d
TJ, Tstg
-55 to +150
260
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 25 V, starting TJ = 25 °C, L = 5.3 mH, Rg = 25 Ω, IAS = 7.7 A (see fig. 12).
c. ISD ≤ 9.2 A, dI/dt ≤ 110 A/μs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
S21-0466-Rev. D, 17-May-2021
Document Number: 91266
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000