IRFR120, IRFU120, SiHFR120, SiHFU120
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
PRODUCT SUMMARY
VDS (V)
100
• Surface Mount (IRFR120, SiHFR120)
• Straight Lead (IRFU120, SiHFU120)
• Available in Tape and Reel
• Fast Switching
• Ease of Paralleling
R
DS(on) ()
VGS = 10 V
0.27
Qg (Max.) (nC)
Qgs (nC)
16
4.4
7.7
Q
gd (nC)
• Material categorization: For definitions of
compliance please see www.vishay.com/doc?99912
Configuration
Single
D
DESCRIPTION
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU, SiHFU series) is for through-hole
DPAK
(TO-252)
IPAK
(TO-251)
D
D
G
S
G
S
D
G
mounting applications. Power dissipation levels up to 1.5 W
S
are possible in typical surface mount applications.
N-Channel MOSFET
ORDERING INFORMATION
Package
DPAK (TO-252)
DPAK (TO-252)
DPAK (TO-252)
DPAK (TO-252)
IPAK (TO-251)
Lead (Pb)-free and Halogen-free SiHFR120-GE3
SiHFR120TR-GE3a SiHFR120TRR-GE3a SiHFR120TRL-GE3a SiHFU120-GE3
IRFR120PbF
IRFR120TRPbFa
SiHFR120T-E3a
IRFR120TRRPbFa
SiHFR120TR-E3a
IRFR120TRLPbFa
SiHFR120TL-E3a
IRFU120PbF
SiHFU120-E3
Lead (Pb)-free
SiHFR120-E3
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
100
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
V
VGS
20
T
C = 25 °C
7.7
Continuous Drain Current
VGS at 10 V
ID
TC = 100 °C
4.9
A
Pulsed Drain Currenta
IDM
31
Linear Derating Factor
0.33
0.020
210
W/°C
Linear Derating Factor (PCB Mount)e
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
EAS
IAR
mJ
A
7.7
Repetitive Avalanche Energya
EAR
4.2
mJ
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)e
T
C = 25 °C
42
PD
W
V/ns
°C
TA = 25 °C
2.5
Peak Diode Recovery dV/dtc
dV/dt
5.5
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d
TJ, Tstg
- 55 to + 150
260
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 25 V, starting TJ = 25 °C, L = 5.3 mH, Rg = 25 , IAS = 7.7 A (see fig. 12).
c. ISD 9.2 A, dI/dt 110 A/μs, VDD VDS, TJ 150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
S13-0171-Rev. C, 04-Feb-13
Document Number: 91266
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000