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IRFP4321

更新时间: 2024-11-25 14:51:39
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
10页 298K
描述
The StrongIRFET? power MOSFET family is optimized for low RDS(on)?and high current capability. The devices are ideal for low frequency applications requiring performance and ruggedness. The comprehensive portfolio addresses a broad range of applications including DC motors, battery management systems, inverters, and DC-DC converters.?

IRFP4321 数据手册

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PD - 97106  
IRFP4321PbF  
HEXFET® Power MOSFET  
Applications  
l Motion Control Applications  
l High Efficiency Synchronous Rectification in SMPS  
l Uninterruptible Power Supply  
l Hard Switched and High Frequency Circuits  
VDSS  
RDS(on) typ.  
150V  
12m:  
Benefits  
15.5m:  
max.  
l Low RDSON Reduces Losses  
l Low Gate Charge Improves the Switching  
Performance  
l Improved Diode Recovery Improves Switching &  
EMI Performance  
ID  
78A  
D
S
D
l 30V Gate Voltage Rating Improves Robustness  
l Fully Characterized Avalanche SOA  
S
D
G
G
TO-247AC  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Symbol  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Parameter  
Continuous Drain Current, VGS @ 10V  
Max.  
78 c  
55  
Units  
A
Continuous Drain Current, VGS @ 10V  
330  
Pulsed Drain Current d  
Maximum Power Dissipation  
Linear Derating Factor  
PD @TC = 25°C  
310  
W
2.0  
W/°C  
V
VGS  
±30  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy e  
EAS (Thermally limited)  
210  
mJ  
°C  
TJ  
-55 to + 175  
Operating Junction and  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
300  
10lbxin (1.1Nxm)  
Mounting torque, 6-32 or M3 screw  
Thermal Resistance  
Parameter  
Junction-to-Case g  
Typ.  
–––  
0.24  
–––  
Max.  
0.49  
–––  
40  
Units  
RθJC  
RθCS  
RθJA  
Case-to-Sink, Flat, Greased Surface  
°C/W  
Junction-to-Ambient g  
www.irf.com  
1
6/23/06  

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